Robert Boschgmbh

Thorsten Mueller

Ando Feyh

Achim Trautmann

Joachim Rudhard

The invention relates to a method for capping a MEMS wafer (), in particular a sensor and/or actuator wafer, with at least one mechanical functional element (). According to the invention, it is provided that the movable mechanical functional element () is fixed by means of a sacrificial layer (), and that a cap layer () is applied to, in particular epitaxially grown onto, the sacrificial layer () and/or to at least one intermediate layer () applied to the sacrificial layer (). The invention also relates to a capped MEMS wafer ().

Method for capping a MEMS wafer and MEMS wafer

A sensor having a monolithically integrated structure for detecting thermal radiation includes: a carrier substrate, a cavity, and at least one sensor element for detecting thermal radiation. Incident thermal radiation strikes the sensor element via the carrier substrate. The sensor element is suspended in the cavity by a suspension.

Sensor for detecting thermal radiation

A component including a via for electrical connection between a first and a second plane of a substrate is provided. The substrate has a borehole having an inner wall that is coated with a conductive layer made of an electrically conductive material, an intermediate layer being disposed between the inner wall and the conductive layer. The intermediate layer includes electrically insulating SiC.

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Reutlingen, Germany

Thorsten Mueller