Rca Inc.

Thomas R Pampalone

Kurt B Kilichowski

Eugene Samuel Poliniak

Nitin V Desai

James John DiPiazza

Emil J Gavalchin

Sidney S Seffren

James J Di Piazza

Paula M Holder

Ahmad H Khan

Anthony Z Miller

The use of o-cresol novolac resin for planarizing large topographic features on a semiconductor substrate is disclosed. In addition to being a superior planarizing material, o-cresol novolac resin oxidizes and darkens upon baking to provide excellent absorption capability for the light wavelengths which are conventionally utilized to irradiate photoresist compositions. O-cresol novolac resin additionally transmits light at higher wavelengths which are used to align pattern masks with alignment keys on a substrate. These properties further make a transparent substrate coated with a patterned layer of o-cresol novolac resin useful as a lithographic mask.

Absorptive planarizing layer for optical lithography

The erosion rate of a layer of negative-working resist is markedly reduced by forming thereon a thin layer of polyfunctional acrylate or methylacrylate monomer. Upon irradiation, the monomer insolubilizes at a faster rate than the resist thereby forming a crust thereon. The result is reduced erosion, improved edge acuity and fewer pinholes in the developed resist pattern.

Two-layer negative resist

A multilayer, photoresist recording medium is disclosed which comprises an absorptive layer and an oxygen plasma-resistant photoresist layer thereover. The structure is substantially free of intermixing of the two layers and separation of the photoresist layer during processing. The absorptive layer is formed by a two-step curing of a composition comprising a solution of a multifunctional acrylate or methacrylate monomer, a suitable dye and a photoinitiator in a suitable solvent. A coating of this composition is rapidly solidified to form an absorptive layer by high intensity irradiation and then baked to remove residual solvent and assure complete polymerization of the monomer.

Process of using absorptive layer in optical lithography with overlying

This invention relates to novel terpolymers of 3-methylcyclopentene, an omega alkynoic acid and sulfur dioxide. Positive radiation sensitive films prepared from the subject terpolymers adhere well to the substrate, demonstrate resistance to cracking and erosion during development and possess excellent edge definition.

Positive radiation sensitive resist terpolymer from omega alkynoic acid

Epoxy resin compositions are disclosed which have an exceptional capacity to penetrate tightly wound wire bundles such as tertiary coils in high voltage flyback transformers. The subject compositions are therefore useful for encapsulating such coils.

Epoxy encapsulating formulation

An improved method for mounting leadless electronic components on printed circuit boards so they can be soldered in place is disclosed. The method utilizes an acrylate adhesive composition which is rapidly cured in two stages by treatment with gaseous sulfur dioxide followed by heat.

Method of mounting electronic components

This invention relates to novel terpolymers of 3-methylcyclopentene, 2-cyclopentene-1-acetic acid and sulfur dioxide. Positive electron beam resist media prepared from the subject terpolymers possesses excellent sensitivity and development latitude and unexpectedly are developable with conventional aqueous alkaline developers.

Aqueous developable poly(olefin sulfone) terpolymers

An improved method of curing compositions of a monomer containing one or more acrylate moieties coated on a substrate is provided wherein the monomer composition is exposed to sulfur dioxide gas in the presence of a free radical initiator having a hydroperoxide moiety.

Sulfur dioxide cured coatings

A method of selectively removing a portion of a layer of material on a substrate by oxygen plasma etching utilizing a mask of a resist material comprising a poly(silane sulfone) copolymer.

Method of plasma etching a substrate

Positive radiation sensitive resist terpolymers

Copolymers of an aziridine and sulfur dioxide are disclosed which are useful as positive radiation resists for use in electron beam and x-ray lithography.

Positive resist for electron beam and x-ray lithography and method of

A method for the manufacture of multi-colored microlithographic displays especially fluorescent screens for cathode ray tubes is provided in which a film of a positive phototackifiable polyacetylene sulfone polymer is applied to the substrate of the display. The film is then exposed in predetermined areas with a sufficient amount of radiation to tackify the exposed areas. The exposed areas are then contacted with a pigment or phosphor which is desired to be applied to the exposed area and it selectively adheres to the exposed areas. The exposure and dusting are repeated for each application of different color pigments, toners or phosphors.

Method for the manufacture of multi-color microlithographic displays

A recording medium is provided which is comprised of a substrate and a film of a polyacetylene sulfone on the surface of the substrate. The recording medium is especially useful in the microlithographic manufacture of electronic circuits using deep ultraviolet exposure.

Growing community of inventors

Belle Mead, NJ, United States of America

Thomas R Pampalone