Kla Tencor Corporation

Thomas Krah

Shifang Li

Kaushik Sah

Moritz Stoerring

Heiko Eisenbach

Wafer edge profile images are analyzed at locations around a bonded wafer, which may have a top wafer and a carrier wafer. An offset curve is generated based on the wafer edge profile images. Displacement of the top wafer to the carrier wafer is determined based on the offset curve. The wafer edge profile images may be generated at multiple locations around the wafer. The wafer edge profile images may be shadowgram images. A system to determine displacement of the top wafer to the carrier wafer can include an imaging system connected with a controller.

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Friedberg, Germany

Thomas Krah