Anvik Corporation

Other

Helix Technology Corporation

Thomas J Dunn

Kanti Jain

Nestor O Farmiga

Donald B Gronachan

Marc I Zemel

Philip A Lessard

Carl Weisbecker

Carl C Kling

Stephen J Yamartino

Jeffrey M Hoffman

Hans T Clarke

Dharmesh G Panchal

Nestor O Framiga

The invention is a seamless projection lithography system that eliminates the need for masks through the use of a programmable Spatial Light Modulator (SLM) with high parallel processing power. Illuminating the SLM with a radiation source (,), which while preferably a pulsed laser may be a shuttered lamp or multiple lasers with alternating synchronization, provides a patterning image of many pixels via a projection system (,) onto a substrate (,). The preferred SLM is a Deformable Micromirror Device (,) for reflective pixel selection using a synchronized pulse laser. An alternative SLM is a Liquid Crystal Light Valve (LCLV) (,) for pass-through pixel selection. Electronic programming enables pixel selection control for error correction of faulty pixel elements. Pixel selection control also provides for negative and positive imaging and for complementary overlapping polygon development for seamless uniform dosage. The invention provides seamless scanning by complementary overlapping scans to equalize radiation dosage, to expose a pattern on a large area substrate (,). The invention is suitable for rapid prototyping, flexible manufacturing, and even mask making.

Seamless, maskless lithography system using spatial light modulator

A projection microlithography system that can pattern very large, curved substrates at very high exposure speeds and any desired image resolution, the substrates being permitted to have arbitrary curvature in two dimensions. The substrate is held rigidly on a scanning stage, on which is also mounted a mask containing the pattern to be formed on the substrate. The mask is imaged on the substrate by a projection subsystem which is stationary and situated above the scanning stage. The mask is illuminated with a polygonal illumination beam which causes a patterned region of similar shape to be imaged on the substrate. Different regions of the substrate are moved in a direction parallel to the direction of the optical axis at the substrate (z-axis) by suitable amounts to keep the segment being exposed within the depth of focus of the imaging lens. The stage is programmed to scan the mask and substrate simultaneously across the polygonal regions so as to pattern the whole mask. Suitable overlap between the complementary intensity profiles produced by the polygonal illumination configuration ensures seamless joining of the scans. This microlithography system includes opto-mechanical mechanisms for dynamically sensing the substrate height at each point, for moving the substrate in the z-dimension, and/or configuring the focal plane of the projection subsystem so as to always keep the substrate region being exposed within the depth of focus of the projection subsystem.

Microlithography system for high-resolution large-area patterning on curved surfaces

A large-format substrate patterning system, for microelectronics manufacturing, utilizes a substrate docking fixture to enable relative motion between the substrate stage and the substrate. This enables exposure of a large-format substrate which has been partitioned into different modules where each module contains an entire pattern transferred from a mask. This projection system enables patterning of a large multi-module substrate using a stage whose range of travel is smaller than the size of the substrate and using a mask whose area is smaller than the size of the substrate. This is accomplished by repositioning the substrate to expose each module sequentially In order to reposition the substrate, its location is maintained fixed in space by a substrate docking fixture while the movable stage of the lithography system is repositioned to position a different module of the substrate in the image field of the lithography tool. This allows the use of a mask whose size is determined by the size of each substrate module, and the use of a scanning stage whose required range of travel is determined by the size of the substrate module, and not by the size of the entire substrate. This eliminates the size limitation of the substrate from dependence on the range of travel of the stage, and permits the repetitive use of a small mask or series of small masks to produce a composite multi-module pattern on the substrate.

Apparatus for projection patterning of large substrates using limited-travel precision x-y stage

In making thermoset and photo-set polymer-matrix composite parts, curing is the key process step that transforms the molecular structure of the composite material, stabilizing it in the desired shape. This curing system applies carefully controlled ultraviolet (UV) radiation dosages, appropriately distributed over the entire surface of the composite part, thereby rapidly curing the material while enabling direct monitoring and control of the curing energy. Previous photo-curing methods have applied generalized radiation to a part with conventional UV lamps. We provide great benefits in cure depth, speed and process control by precisely controlling all parameters of UV dosage, by computed control, by markings on the part, or by dynamic feedback control from embedded sensors or non-contact sensors. This system can apply greater radiation dose to areas of increased quantities of resin, such as support ribs, and lesser radiation dose to areas of decreased quantities of resin. This method can be enhanced by using differing resins which respond to differing wavelengths, and also by controlled changes of radiation field size or duration. This curing system also enables temporary joining of parts by sufficient partial or controlled-area photo-setting, which may also be integrated with lay-up or winding operations. As a result, these partially cured parts can be handled safely through later stages of the manufacturing process, such as final photo-setting or baking operation in an oven or autoclave.

Ultraviolet-based, large-area scanning system for photothermal

Economical production of laser-drilled high-precision, ultra-miniature multiple-via-hole patterns is accomplished by multiplexing the homogenized, shaped, nearly-collimated output of a high-power excimer laser into a modular set of condenser lens/mask/projection lens beamlines. A substrate delivery subsystem provides a continuous supply of film substrate segments as blanks during production. Functional modularization permits the building and easy retooling of a hard-tooling multiple-beamline system powered by a high-power laser. Vertical modularization permits the building of a single-beamline soft-tooling pilot system, which may be used to demonstrate a production technique, or may be used for short production runs, and which may later be incremented with additional vertical subassemblies for additional beamlines. Multiplexing of the laser output beam into the set of beamlines is accomplished by an illumination module, which may be implemented as a single 100%-reflective fold mirror for a single-beamline pilot system, and can also be implemented as a single-block echelon mirror, or implemented as a multi-beamsplitter set of decreasing-reflectivity mirrors as mirror position approaches the beam source. The resulting product is a film blank with a via-pattern of precise micro-vias, useful as an aerosol nozzle or filter.

High-speed drilling system for micro-via pattern formation, and

In the manufacturing of flexible, large-area electronic modules such as flat-panel displays (FPDs), the high cost and low yields of currently available patterning equipment represent a significant barrier to cost-effective production. This invention provides a projection imaging system that can pattern very large, flexible substrates at very high exposure speeds with almost any desired image resolution. The master pattern to be imprinted on the substrate is contained on a mask which, similar to the substrate, is made of a flexible material The mask and substrate are scanned by rollers through the object and the image field, respectively, of a 1:1 projection lens. All of the rollers are driven by identical drive systems linked to a common motor; therefore, the scanning of the mask and substrate is perfectly synchronized. Both the mask and the substrate, along with their rollers, are mounted on a linear translation stage. The translation stage scans continuously at a velocity which is chosen such that, for every complete rotation of the mask and substrate, the linear stage will move by the effective scan width. The entire substrate is patterned using one continuous helical scan. Suitable overlap between complementary intensity profiles produced by a hexagonal illumination configuration ensures seamless joining of the scans. The use of rollers significantly enhances the throughput and effectively reduces the payload and footprint of the scanning stage leading to substantial system cost savings.

Very large area patterning system for flexible substrates

A high-performance projection optical system uses the multiple spectral peaks of an excimer laser system by using an optical dispersive system to physically separate the broadband laser output into separate narrowband beams which can be used for imaging different substrate surfaces simultaneously. The separated narrowband beams are directed along different optical paths and used to illuminate the object planes of different, identical projection lenses. The projection lenses are designed for the narrowed bandwidth corresponding to one spectral peak of the excimer laser rather than the broadband, multiple-peak laser output This dramatically simplifies both the design and the construction of the projection lens, leading to substantial cost-savings. The conversion of the single-beam, broadband spectral output into a multiple-beam, narrowband source is accomplished by optical dispersion means consisting of either several prisms in series, one or more prisms followed by a mirror reflecting back through the prisms, or one or more reflective gratings. The separated narrowband beams are useful for imaging top and bottom of a single substrate with exact registration useful for via-hole connections. Other uses include simultaneous imaging of multiple substrates, using one or more stages.

Double-sided patterning system using dual-wavelength output of an

A large-format substrate patterning system, for microelectronics manufacturing, utilizes a substrate docking fixture to enable relative motion between the substrate stage and the substrate. This enables exposure of a large-format substrate which has been partitioned into different modules where each module contains an entire pattern transferred from a mask. This projection system enables patterning of a large multi-module substrate using a stage whose range of travel is smaller than the size of the substrate and using a mask whose area is smaller than the size of the substrate. This is accomplished by repositioning the substrate to expose each module sequentially. In order to reposition the substrate, its location is maintained fixed in space by a substrate docking fixture while the movable stage of the lithography system is repositioned to position a different module of the substrate in the image field of the lithography tool. This allows the use of a mask whose size is determined by the size of each substrate module, and the use of a scanning stage whose required range of travel is determined by the size of the substrate module, and not by the size of the entire substrate. This eliminates the size limitation of the substrate from dependence on the range of travel of the stage, and permits the repetitive use of a small mask or series of small masks to produce a composite multi-module pattern on the substrate.

Projection patterning of large substrates using limited-travel x-y stage

The absolute distance measuring interferometer (ADMI) is a multi-pass interferometer which is a resonant cavity consisting of two plane parallel mirrors whose length is referenced to a stabilized laser system. The resonant cavity can be used in order to measure very precisely (to within a fraction of a wavelength) the distance between a reference plane and an object. Due to its multi-pass nature, the length of the cavity can be measured much more accurately than for a conventional interferometer. The optical transmission bandwidth of the resonant cavity is inversely proportional to its length. A direct measure of the transmission bandwidth provides an extremely precise (to within a fraction of a wavelength) absolute measure of the length of the cavity. This eliminates the need for careful alignment during the motion of one of the mirrors of the multi-pass interferometer. In fact one can completely decouple the mirrors of the resonant interferometer and reassemble the resonant cavity at a different separation and measure the change in distance. This is extremely useful in situations where it is not possible to change distances while maintaining alignment of the cavity.

Absolute distance measuring interferometry using multi-pass resonant

A Fabry-Perot resonator, also called a Fabry-Perot cavity, is a spectroscopic device of extremely high resolving power and is a very useful tool for alignment of mask and wafer for the multiple exposures necessary to make a semiconductor integrated circuit. When a Fabry-Perot cavity is used for alignment in a multi-exposure imaging procedure, the cavity itself must be very accurately aligned for each exposure. For proper alignment system operation, it is necessary that one of the mirrors of the resonant cavity be fixed with respect to the mask, and the other mirror be fixed with respect to the wafer. This invention provides a mechanical system and method to maintain the alignment of a Fabry-Perot cavity for each exposure. This invention describes a technique in which the Fabry-Perot cavity is transported from one exposure area to the next without need for realignment. After an exposure is completed, the mechanical link between one of the mirrors and the mask is designed to be decoupled while the mask and wafer are relatively displaced for the next exposure. As a result, during the displacement, the relative distance between the optical mirrors of the Fabry-Perot cavity is maintained, as well as the relative orientation. After the displacement is completed, the mechanical link is then re-established so that the alignment system performs in an identical manner for each exposure site.

Transporter for optical spectrum analyzer in alignment system

A self-cleaning pressure relief valve has a spring-biased valve closure with an annular contact edge which makes contact with an o-ring to seal the valve. The annular contact edge is slightly larger in radius than the central radius of the o-ring so that changing pressure on the closure causes the contact edge to slide along the surface of the o-ring.

Pressure relief valve and cryopump utilizing the same

Stair climbing exercising apparatus for use under water comprising a pair of laterally adjacent stepping levers pivotally mounted between the two ends of the levers, the exerciser stepping on one end, and water resistance imposing member mounted the levers. The amount of water resistance being imposed is adjustable. In another embodiment, a paddle wheel is employed with blades along the outer periphery being adjustable to vary the amount of water resistance.

Water immersed stair climber

Stair climbing exercising apparatus for use under water comprising a pair of laterally adjacent stepping levers pivotally mounted at one end, the excerciser stepping on the other end, and resistance to downward motion being imposed by the buoyancy of bladders attached to said stepping levers.

Water immersed stair climber with air bladder

A cryopump having at least two temperature stages for pumping gases at their optimal temperatures. A first embodiment has a third temperature stage that is surrounded by and separated from the second temperature stage which is surrounded by and separated from the first temperature stage. Adsorbent placed on the second and third stages are operated at different temperatures to prevent gases with higher critical mobility temperatures from becoming immobilized at the entrance of pores and wells along the surface of the adsorbent. Another embodiment has at least a second stage, a temperature sensor, and a heater to maintain the second stage temperature at optimal level for the gas being pumped.

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Mohegan Lake, NY, United States of America

Thomas J Dunn