Memc Electronic Materials, Inc.

Memc Singapore Pte. Ltd. (uen200614794d)

Thomas E Doane

Henry Frank Erk

Guoqiang (David) Zhang

Judith A Schmidt

Roland R Vandamme

Peter D Albrecht

Jihong John Chen

Dale A Witte

Eugene R Hollander

Linda K Swiney

Travis L Hambach

Alexis Grabbe

Guoqiang David Zhang

Susan S Dwyer

Shawn Wesley Hayes

Mark G Stinson

James Raymond Capstick

Mick Bjelopavlic

Jozef G Vermeire

Judy A Schmidt

A method of producing rectangular seeds for use in semiconductor or solar material manufacturing includes connecting an adhesive layer to a top surface of a template, the template including a plurality of parallel slots, and drawing alignment lines on the adhesive layer, the alignment lines aligned with at least some of the parallel slots. The method also includes connecting quarter sections to the adhesive layer such that an interface between a rectangular seed portion and a curved wing portion of each quarter section is aligned with at least one of the alignment lines drawn on the adhesive layer, and slicing each of the quarter sections to separate the rectangular seed portions from the curved wing portions.

Methods for producing rectangular seeds for ingot growth

A method of producing rectangular seeds for use in semiconductor or solar material manufacturing includes connecting an adhesive layer to a top surface of a template, the template including a plurality of parallel slots, and drawing alignment lines on the adhesive layer, the alignment lines aligned with at least some of the parallel slots. The method also includes connecting quarter sections to the alignment layer such that an interface between a rectangular seed portion and a curved wing portion of each quarter section is aligned with at least one of the alignment lines drawn on the adhesive layer, and slicing each of the quarter sections to separate the rectangular seed portions from the curved wing portions.

The present disclosure generally relates to the manufacture of silicon wafers, and more particularly to edge etching apparatus and methods for etching the edge of a silicon wafer.

Methods for etching the edge of a silicon wafer

Edge etched silicon wafers

A process for etching silicon wafers using a caustic etchant in the form of an aqueous solution comprising water, a hydroxide ion source, and a chelating agent. The process produces silicon wafers substantially free from diffused metal ions.

Silicon wafer etching process and composition

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Troy, MO, United States of America

Thomas E Doane