Varian Semiconductor Equipment Associates, Inc.

Thirumal Thanigaivelan

Benjamin Colombeau

Deepak Arabagatte Ramappa

Christopher R Hatem

Kyu-Ha Shim

Dennis P Rodier

An improved method of performing pocket or halo implants is disclosed. The amount of damage and defects created by the halo implant degrades the performance of the semiconductor device, by increasing leakage current, decreasing the noise margin and increasing the minimum gate voltage. The halo or packet implant is performed at cold temperature, which decreases the damage caused to the crystalline structure and improves the amorphization of the crystal. The use of cold temperature also allows the use of lighter elements for the halo implant, such as boron or phosphorus.

Optimized halo or pocket cold implants

Embodiments of this method improve the results of a chemical mechanical polishing (CMP) process. A surface is implanted with a species, such as, for example, Si, Ge, As, B, P, H, He, Ne, Ar, Kr, Xe, and C. The implant of this species will at least affect dishing, erosion, and polishing rates of the CMP process. The species may be selected in one embodiment to either accelerate or decelerate the CMP process. The dose of the species may be varied over the surface in one particular embodiment.

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North Andover, MA, United States of America

Thirumal Thanigaivelan