Japan Electronic Materials Corporation

Nihon Denshizairyo Kabushiki Kaisha

Shinko Electric Industries Co., Ltd.

Japan Electronics Material Corporation

Teppei Kimura

Atsuo Urata

Kazumichi Machida

Tomoyuki Takeda

Noriyuki Fukushima

Liwen Fan

Naoki Arita

Akinori Shiraishi

Kosuke Fujihara

Atsushi Mine

Toranosuke Furusho

Teruhisa Sakata

The present invention intends to suppress a contact probe from interfering with a guide plate to produce shavings. The present invention has stacked structure that sandwiches an intermediate metallic layerbetween outer metallic layersand, and includes: a contact partthat is brought into abutting with a test object; an elastic deformation partthat is elastically deformed so as to be curved in a predetermine direction of curvature N by compression force in the longer direction; and a fore end partthat is formed between the contact partand the elastic deformation partand supported by a through-holeof a guide plateso as to make the contact partmovable in the longer direction, in which side surfaces of the fore end partformed in the direction of curvature N and a direction N' opposite to the N of the elastic deformation partare configured to include the three metallic layersto, and on the side surfaces, the intermediate metallic layeris configured to protrude relative to the outer metallic layersand

Contact probe

It is an object of the invention to provide a guide plate for a probe card with fine through holes at tight pitches and with increased strength. The guide platefor a probe card includes a metal basefirst insulation layersand metal layersThe metal basehas a plurality of through holesto receive probes therethrough, and inner walls of the through holesThe first insulation layersare of tuboid shape and provided on the respective inner walls of the through holesof the metal baseThe metal layersare provided on the first insulation layers

Guide plate for a probe card and probe card provided with same

It is an object of the invention to provide a guide plate for a probe card with fine through holes at tight pitches and with increased strength. The guide platefor a probe card includes a metal base; first insulation layers; and metal layers. The metal basehas a plurality of through holesto receive probes therethrough, and inner walls of the through holes. The first insulation layersare of tuboid shape and provided on the respective inner walls of the through holesof the metal base. The metal layersare provided on the first insulation layers

The invention provides a guide plate for a probe card including a silicon substrate including a surface and a through-hole, an edge part of the through-hole, and a curved-face part. The through-hole is configured to guide a probe and includes an inner wall face. The edge part of the through-hole is constituted by the surface of the silicon substrate and the inner wall face of the through-hole. The curved-face part is formed on the edge part and formed of a silicon dioxide film.

Guide plate for probe card

The invention aims to provide a vertical type probe card in which a probe can scrape an oxide film on a surface of an electrode of the measurement object, thereby ensuring stable contact with the electrode of the measurement object. A probe card A includes: first and second probesand; a guide substratein which a plurality of guide holesare formed through which the first and second probesandare inserted in a freely movable manner; a support memberprovided above the guide substrate; a first sheet memberof flexibility, attached to the support member, having a first electrode padon its surface, in which a tail endof the first probeprojecting out from the guide holeis brought into contact with the first electrode pad; a second sheet memberof flexibility, attached to the support member, having a second electrode padon its surface, in which a tail endof the second probeprojecting out from the guide holeand penetrating through the first sheet memberis brought into contact with the second electrode pad; and vibrating meansattached to the support member, wherein the vibrating meansvibrates the first and second probesandvia the support memberand the first and second sheet membersand

Probe card

It is an object of the present invention to provide an arch type probe capable of enduring a load caused by overdriving even if the probe is miniaturized, and a probe card using the same. An arch type probehas a shape including a first quarter circle arc portionwhich is supported at one end thereof by the base plateand a second quarter circle arc portionwhich is connected to the other end of the first quarter circle arc portionextending toward the base plate and a little shorter than the first quarter circle arc portionThe top portion of the arch type probeserves as a contact surface brought into contact with an electrode of a semiconductor water B.

A probe card including rectilinear probes; a guide base plate having an insulating property, in which a plurality of guide holes are formed through which the probes are inserted in a freely movable manner and a length of a guide hole is shorter than a length of a probe; and a plurality of sheet members having an insulating property, disposed above the guide base plate facing the plate, and laminated one on another with a spacing therebetween so as not to be in contact with one another. The tail ends of some of the probes can be brought into contact with the electrode pads on a lowest sheet member, and the tail ends of the other probes penetrate through the lowest sheet member so as to be enabled to be in contact with electrode pads on other sheet members.

Growing community of inventors

Amagasaki, Japan

Teppei Kimura