Kabushiki Kaisha Kobe Seiko Sho

Kobe Steel, Ltd.

Takenaka Corporation

Mmc Kobelco Tool Co., Ltd.

Tatsuya Yasunaga

Hiroshi Satoh

Yasuaki Sugizaki

Hidetoshi Nishimoto

Keiji Ueda

Takashi Yashiki

Kenji Yamamoto

Akira Fujishima

Toshiki Sato

Kazuhito Hashimoto

Toshio Saito

Takashi Onishi

Takenori Nakayama

Hideo Fujii

Takatoshi Ogawa

Yoshimasa Ito

Tetsuya Yoshikawa

Natsuki Ichimiya

Yusuke Tanaka

Jun Munemasa

Yasuyuki Yamada

Koichi Maeda

Sadatoshi Ohno

Taiitsu Aoki

Seiichiro Kitaura

Genki Matsumoto

Yasunori Wada

Fumio Kamikubo

Yoshinori Terada

Yasutaka Okazaki

Atsumichi Kushibe

Takashi Kato

Kenji Umei

Cu-based interconnections are fabricated in a semiconductor device by depositing a thin film of Cu or Cu alloy on a dielectric film by sputtering, the dielectric film having trenches and/or via holes at least one groove and being arranged on or above a substrate, and carrying out high temperature and high pressure treatment to thereby embed the Cu or Cu alloy into the trenches and/or via holes, in which the sputtering is carried out at a substrate temperature of &#x2212;20&#xb0; C. to 0&#xb0; C. using, as a sputtering gas, a gaseous mixture containing hydrogen gas and an inert gas in a ratio in percentage of 5:95 to 20:80.

Method for fabricating copper-based interconnections for semiconductor device

Hard coating coated member having excellent wear resistance

A metal material having a photocatalytic activity which comprises an anodized layer and a thin layer containing titanium oxide powder which are heat treated are sequentially laminated on the surface of a substrate comprising metal material including titanium. By anodically oxidizing the metal material including titanium, an anodized layer is formed on the surface thereof. A thin layer containing titanium oxide powder is further coated on this surface, and heat treatment is carried out before and/or after forming this thin layer containing titanium oxide powder.

Metal material having photocatalytic activity and method of

A machine part comprises: a base part formed of a titanium alloy or an aluminum alloy and having a roughened surface of Ra 0.5 .mu.m or above and PPI.sub.50 or above; and a Ni--P electrodeposit layer formed over the surface of the base part by an electroplating process using a Ni--P plating bath containing a stress relaxing agent, and having a stress of 20 kgf/mm.sup.2 or below. The machine part has a small specific gravity, excellent seizure resistance, wear resistance and fatigue strength.

Machine part resistant to rolling friction

A corrosion resistant Ti based alloy comprising:

Corrosion resistant Ti alloy containing Cu, Si, and a platinum group

Corrosion resistant Ti-Cr-Ni alloy containing a platinum group metal

Growing community of inventors

Kobe, Japan

Tatsuya Yasunaga