Tokyo Ohka Kogyo Co., Ltd.

Tatsuya Hashiguchi

Toshimasa Nakayama

Hideo Hada

Hiroshi Komano

Kazuyuki Nitta

Mitsuru Sato

Hidekatsu Kohara

Satoshi Niikura

Atsushi Sawano

Hiroshi Hosoda

Disclosed is a novel and improved photoresist composition which comprises: (A) a film-forming resinous compound which is, in the presence of an acid, subject to a change in the solubility in an alkaline solution; and (B) an acid-generating agent capable of releasing an acid by the exposure to actinic rays which is an oxime sulfonate compound represented by the general formula

Photoresist composition

A positive photoresist composition comprising (A) an alkali-soluble resin and (B) a light-sensitive component comprising at least one compound represented by the following general formula (I): ##STR1## where R.sup.1, R.sup.2 and R.sup.3 are each independently a hydrogen atom, an alkyl group having 1-3 carbon atoms or an alkoxy group having 1-3 carbon atoms; R.sup.4 is a hydrogen atom or an alkyl group having 1-3 carbon atoms; a, b and c are an integer of 1-3; l, m and n are an integer of 1-3, in which at least part of the hydroxyl groups present are esterified with a quinonediazidosulfonic acid and a sulfonic acid which has a group represented by the following formula (II):

Positive photoresist compositions and multilayer resist materials using

Disclosed is a class of novel cyanooxime sulfonate compounds represented by the general formula

Cyanooxime sulfonate compound

Growing community of inventors

Chigasaki, Japan

Tatsuya Hashiguchi