Tokyo Electron Limited

International Business Machines Corporation

Other

Tokyo Electrcn Limited

Tatsuo Hatano

Atsushi Gomi

Yasushi Mizusawa

Naoki Watanabe

Masamichi Hara

Seishi Murakami

Hideaki Yamasaki

Taro Ikeda

Tadahiro Ishizaka

Tetsuya Miyashita

Hiroyuki Toshima

Yumiko Kawano

Naoyuki Suzuki

Shinji Furukawa

Tsukasa Matsuda

Takashi Sakuma

Osamu Yokoyama

Satoshi Taga

Chiaki Yasumuro

Sandra Guy Malhotra

Fenton Read McFeely

Kenji Suzuki

Gert J Leusink

Kaoru Yamamoto

Yasuhiko Kojima

Mitsuhiro Tachibana

Masahito Sugiura

Yuichiro Fujikawa

Atsushi Shimada

Takaya Shimizu

Kenzi Suzuki

Takara Kato

Andrew Herbert Simon

John Jacob Yurkas

Kaoru Maekawa

Kunihiro Tada

Masahiko Matsudo

Hiroyuki Nagai

Mitsuya Ohashi

Tatsuo Hirasawa

Koji Maeda

Tetsuya Tamura

Junichi Takei

Isamu Mouri

Kazuhito Nakamura

Tadayuki Kawashima

Kazunaga Ono

Koumei Matsuzawa

Yuuki Motomura

Tadashi Mitsunaga

Yasuhiro Otagiri

Tomoyuki Fujihara

Koumei Matsuzava

Keishi Akiba

A film forming apparatus comprising: a processing container for accommodating a plurality of substrates, a substrate holder provided in the processing container and configured to hold the substrates such that the plurality of substrates are arranged along a circumferential direction; a rotating and revolving mechanism configured to rotate the plurality of substrates on the substrate holder and revolve the plurality of substrates on the substrate holder along the circumferential direction; and a sputtered particle emitting mechanism configured to emit sputtered particles to the plurality of substrates held by the substrate holder. Sputtering film formation is performed by emitting the sputtered particles from the sputtered particle emitting mechanism while rotating and revolving the plurality of substrates held by the substrate holder using the rotating and revolving mechanism.

Film forming apparatus and film forming method

A substrate transfer device, includes: a first planar motor installed in a first chamber and having an array of coils; a second planar motor installed in a second chamber connected to the first chamber and having an array of coils; a pair of transfer units configured to move on at least one of the first planar motor and the second planar motor and configured to transfer a substrate; and a controller configured to control supply of electric current to the coils of the first planar motor and the second planar motor.

Substrate transfer device and substrate processing system

A vacuum transfer device configured to transfer a substrate in a vacuum includes: a flat motor including a body, a plurality of electromagnetic coils arrayed in the body, and a current controller that controls a current supplied to the electromagnetic coil; a transfer unit including a substrate holder configured to hold a substrate, and a base having a plurality of magnets arrayed therein and magnetically levitating from a surface of the body by a magnetic field generated by the electromagnetic coil, and move in a magnetically levitating state thereby moving the substrate holder; and a temperature controller configured to adjust temperature of at least a portion of the body. The temperature of the transfer unit is adjusted by stopping the magnetic levitation of the base by controlling the current supplied to the electromagnetic coil, and bringing the base into contact with a temperature-adjusted portion of the body.

Vacuum transfer device, substrate processing system, and substrate processing method

A substrate transfer apparatus for transferring a substrate is disclosed. The apparatus comprises: a transfer unit including a substrate holder configured to hold a substrate, and a base having therein a magnet and configured to move the substrate holder; a planar motor including a main body, a plurality of electromagnetic coils disposed in the main body, and a linear driver configured to supply a current to the electromagnetic coils, and magnetically levitate and linearly drive the base; a substrate detection sensor configured to detect the substrate when the substrate held by the substrate holder passes by; and a transfer controller configured to calculate an actual position of the substrate held by the substrate holder based on detection data of the substrate detection sensor, calculate correction values for a logical position that has been set, and correct a transfer position of the substrate based on the correction values.

Substrate transfer apparatus, substrate transfer method, and substrate processing system

A substrate transfer apparatus includes a planar motor provided in a transfer chamber and having coils arranged therein, a transfer unit movable on the planar motor, and a control unit configured to control an energization of the coils. The transfer unit includes two bases having magnets arranged thereon and configured to be movable on the planar motor, a substrate support member configured to support a substrate, and a link mechanism configured to connect the two bases and the substrate support member to each other.

Substrate transfer apparatus and substrate processing system

A substrate transport apparatus which transports a substrate to a substrate transport position. The apparatus comprises: a transport unit including a substrate holder that holds the substrate, a base having magnets and configured to move the substrate holder, and a link member connecting the substrate holder to the base; and a planar motor having a main body, electromagnetic coils arranged in the main body, and a linear driver supplying power to the electromagnetic coils to magnetically levitate and linearly drive the base. The base includes a first member and a second member rotatably provided in the first member, and the magnets are provided inside the first member and the second member, the link member is rotatably connected to the second member, and the linear driver rotates the second member with respect to the first member and expands and contracts the substrate holder via the link member.

Substrate transport apparatus, substrate transport method, and substrate processing system

The substrate transfer apparatus includes a planar motor provided in a transfer chamber and having coils arranged therein; a transfer unit movable on the planar motor; and a control unit configured to control an energization of the coils. The transfer unit includes two bases having magnets arranged thereon and configured to be movable on the planar motor, a substrate support member configured to support a substrate, and a link mechanism configured to connect the two bases and the substrate support member to each other.

A vacuum transfer device includes: a main body including an arm unit with an internal mechanical part therein and a vacuum seal, and configured to transfer a high temperature substrate in a vacuum; a substrate holder connected to the main body to hold the substrate; a heat transport member provided on a surface of the main body and made of a material having a higher thermal conductivity than that of a material constituting the main body in a creeping direction to transport heat transferred from the substrate to the substrate holder; and a heat radiator configured to dissipate heat transported by the heat transport member.

Vacuum transfer device and substrate processing system

A film-forming device according to one embodiment includes a chamber body, a support, a moving device, a shielding member, a first holder and a second holder, in the film-forming device, a substrate supported by the support is linearly moved. The shielding member is disposed above an area where the substrate is moved, and includes a slit extending in a direction perpendicular to a movement direction of the substrate. The first holder and the second holder hold a first target and a second target, respectively, above the shielding member. The first target and the second target are arranged symmetrically with respect to a vertical plane including a linear path on which the center of the substrate is moved.

Film-forming device

A sputtering method including: performing a pre-sputtering by emitting sputter particles from a target provided in a sputtering apparatus in a state where the target is shielded by a shielding portion of a shutter provided closed to the target to be capable of opening/closing the target; and, after the pre-sputtering, performing a main-sputtering by emitting the sputter particles from the target in a state where an opening of the shutter is aligned with the target thereby depositing the sputter particles on a substrate. When the pre-sputtering and the main-sputtering are repeatedly performed, a shutter position is changed during the pre-sputtering so as to change a position of the shielding portion aligned with the target.

Sputtering method and sputtering apparatus

A stage device for holding a substrate in a processing apparatus for processing the substrate includes a stage, a stage rotating mechanism, and a cold heat transfer mechanism. The stage is configured to hold the substrate in a processing chamber. The stage rotating mechanism includes a rotation shaft extending downward from a center of a bottom surface of the stage and a motor configured to rotate the stage via the rotation shaft. The cold heat transfer mechanism includes at least one cold heat transfer body that is fixedly disposed at a position spaced away from the rotation shaft below the stage and is configured to transfer cold heat of a chiller. The cold heat transfer mechanism is disposed with a gap between the cold heat transfer mechanism and the stage.

Stage device and processing apparatus

There is provided a method of forming an insulating film which includes providing a workpiece having a base portion and a protuberance portion formed to protrude from the base portion; and forming an insulating film on the workpiece by sputtering. The forming an insulating film includes forming the insulating film while changing an angle defined between the workpiece and a target.

Method of forming later insulating films for MTJ

There is provided a mounting table system which includes: a mounting table rotatably installed so as to mount a substrate thereon; a plurality of heating parts installed in the mounting table, and configured to heat the mounting table; a single power source configured to supply an electric power to the plurality of heating parts; and a power switching part configured to switch from a first heating part among the plurality of heating parts to which the electric power is supplied from the single power source, to a second heating part among the plurality of heating parts, depending on a rotational angle of the mounting table.

Mounting table system, substrate processing apparatus, and temperature control method

A method for forming a copper film is provided. In the method, a base film that is a titanium nitride film, a tungsten film or a tungsten nitride film is formed along a surface of an insulating film of an object. A copper film is formed on the base film of the object cooled to a temperature of 209 K or less.

Method for forming copper film

There is provided a method for performing a pre-treatment to form a copper wiring in a recess formed in a substrate, which includes forming a barrier layer on a surface of the substrate that defines the recess, and forming a seed layer on the barrier layer. The method further includes at least one of etching the barrier layer and etching the seed layer. In the at least one of etching the barrier layer and etching the seed layer, the substrate is inclined with respect to an irradiation direction of ions while rotating the substrate.

Method and processing apparatus for performing pre-treatment to form copper wiring in recess formed in substrate

Growing community of inventors

Nirasaki, Japan

Tatsuo Hatano