Mitsubishi Materials Corporation

Other

Mitsubishi Metal Corporation

Tatsunori Kobayashi

Hiroshi Tanaka

Jiro Kajiwara

Masayuki Inoue

Kanji Hosoki

Yasuyuki Ogata

Mutsumi Yasutake

Naoki S Rikita

Seiji Harada

Junzo Koyasu

Eturo Morita

Makoto Hasegawa

A wafer-polishing head which has an increased flexible membrane life and improved wafer polishing accuracy has a principal head having a lower opening portion with an approximately circular shape. A flexible membrane which is positioned in the opening portion of the principal heal head for closing the opening portion and for holding a wafer W at the underside of an inward peripheral portion of the flexible membrane. A sealed pressurizing chamber is formed by closing the opening portion with the flexible membrane. A pressure regulator is provided for controlling the internal pressure of the pressurizing chamber . The flexible membrane is thicker in an outer peripheral portion thereof than in the inward peripheral portion which holds the wafer.

Wafer-polishing head and polishing apparatus having the same

A polishing apparatus has a plurality of polishing stations for polishing materials to be polished and a plurality of cleaning stations for cleaning the materials being polished, the polishing stations and the cleaning stations being alternately arranged; and an arm for holding the materials being polished and transferring the materials being polished between the polishing stations and the cleaning stations successively. The arm includes a polishing head for holding the material being polished. Each of the cleaning stations comprises a retainer stand on which the material being polished is placed, and a cleaning device for cleaning the material being polished in a state held by the polishing head, cleaning the material being polished in a state placed on the retainer stand, and cleaning the polishing head in a state where the material being polished is separated from the polishing head. A polishing method is used in a polishing apparatus having a plurality of polishing stations for polishing materials to be polished and an arm for holding the materials being polished and transferring the materials being polished between the polishing stations successively, each of the polishing stations including a platen having a polishing pad affixed to a surface of the platen, the arm including a plurality of polishing heads, each of which holds the material being polished and brings one surface of the material being polished into contact with the polishing pad, the material to be polished being polished by the polishing pad with relative movement between the polishing head and the platen. The polishing method comprises the steps of fitting a spindle for supporting the polishing head in a horizontally rotatable manner into each of fitting portions formed in each of a plurality of spindle housings provided in the arm; rotating the material being polished and the polishing pad relatively while keeping the material being polished and the polishing pad contacted with each other; and adjusting an axial position of the polishing head and changing a position of the polishing head relative to the arm by an adjusting mechanism provided on the spindle, whereby the materials to be polished are each polished while being adjusted in position thereof

Polishing apparatus, polishing method and method of conditioning polishing pad

The present invention provides a wafer polishing apparatus provided with a platen on the surface of which a polishing pad is affixed, and a wafer holding head for allowing one face of a wafer to contact the polishing pad by holding the wafer to be polished, the wafer being polished by a relative motion between the wafer holding head and the platen, wherein a dress ring is provided with an abrasive grain layer at the lower part at the outside of the wafer holding head so as to be rotatable while being in contact with the surface of the polishing pad.

Wafer transfer apparatus and wafer polishing apparatus, and method for manufacturing wafer

The present invention provides wafer polishing apparatus in which the wafer holding head comprises a diaphragm substantially vertically expanded to the head axis in the head body; a carrier, which is fixed to the diaphragm and provided so as to be able to displace along the head axis direction together with the diaphragm; a retainer fixed to the diaphragm in a concentric relation to the carrier; a pressure adjusting mechanism for controlling the pressure of a fluid chamber formed between the diaphragm and the head body; a plurality of carrier torque mechanisms provided between the head body and the carrier for communicating the torque of the head body to the carrier; a plurality of first sensors, which is provided at individual torque transfer mechanism, for observing the force along the direction of rotation acting on the wafer; and a processor, which is connected to each first sensor, for calculating the force acting on the wafer based on the output from these first sensors.

Wafer holding head and wafer polishing apparatus, and method for manufacturing wafers

Disclosed is a hydraulically fixable flange, which is detachable by expansion and contraction of the internal bore employing hydraulic fluid, in which a hydraulic chamber is provided within the flange body, and a hole for supplying hydraulic fluid, which is connected to the outside from the hydraulic chamber, is also provided, together with valve system provided between the hydraulic chamber and the hole for supplying hydraulic oil so that the system can supply pressurized oil to the hydraulic chamber from outside. Also, there is disclosed a rotary knife provided with the hydraulically fixable flange.

Rotary knife

A rotary knife assembly includes a rotary shaft, a flange, a rotary knife of an annular shape and a resilient member. The flange includes a radially-outwardly protruding flange portion having opposite end faces and a reduced diameter portion disposed adjacent to the flange portion. The rotary knife has opposite faces and is fitted on the reduced-diameter portion of the flange with one of the opposite faces directed toward one of the opposite end faces of the flange portion. The resilient member is mounted on the flange for urging the rotary knife toward the flange portion. There is also provided a shifting mechanism mounted on the flange for shifting the rotary knife in a direction away from the flange portion against the urging force of the resilient member.

Growing community of inventors

Omiya, Japan

Tatsunori Kobayashi