Growing community of inventors

Hsin-Chu, Taiwan

Tasi-Jung Wu

Average Co-Inventor Count = 6.87

ph-index = 3

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 35

Tasi-Jung WuWen-Chih Chiou (9 patents)Tasi-Jung WuTsang-Jiuh Wu (9 patents)Tasi-Jung WuHsin-Yu Chen (9 patents)Tasi-Jung WuLin-Chih Huang (9 patents)Tasi-Jung WuKu-Feng Yang (7 patents)Tasi-Jung WuYung-Chi Lin (5 patents)Tasi-Jung WuHsiao Yun Lo (5 patents)Tasi-Jung WuYuan-Hung Liu (2 patents)Tasi-Jung WuTasi-Jung Wu (9 patents)Wen-Chih ChiouWen-Chih Chiou (358 patents)Tsang-Jiuh WuTsang-Jiuh Wu (96 patents)Hsin-Yu ChenHsin-Yu Chen (75 patents)Lin-Chih HuangLin-Chih Huang (18 patents)Ku-Feng YangKu-Feng Yang (83 patents)Yung-Chi LinYung-Chi Lin (76 patents)Hsiao Yun LoHsiao Yun Lo (7 patents)Yuan-Hung LiuYuan-Hung Liu (37 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Taiwan Semiconductor Manufacturing Comp. Ltd. (9 from 40,927 patents)


9 patents:

1. 11728296 - Interconnect structure and method of forming same

2. 10811374 - Interconnect structure and method of forming same

3. 10157866 - Interconnect structure and method of forming same

4. 9953920 - Interconnect structure and method

5. 9748190 - Low cost and ultra-thin chip on wafer on substrate (CoWoS) formation

6. 9679859 - Interconnect structure and method of forming same

7. 9252110 - Interconnect structure and method of forming same

8. 9006101 - Interconnect structure and method

9. 8951838 - Low cost and ultra-thin chip on wafer on substrate (CoWoS) formation

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