National Science Council

Industrial Technology Research Institute

Tan F Lei

Chung L Lee

Wen C Huang

Hsiao-Yi Lin

Tsung-Shin Chen

A new Schottky diode structure, Pt/Al/n-InP, is disclosed in the present invention. The thickness of Al layer of the Schottky diode structure is restricted in a range of about 80-120 .ANG.. This structure gives a barrier height of 0.74 eV and an ideality factor of 1.11 after it was annealed at 300.degree. C. for 10 min. This is due to the formation of Aluminum-oxide, as the interfacial layer to improve barrier height. A method of preparing this Schottky diode structure is also disclosed in the present invention.

N-INP Schottky diode structure and a method of making the same

N-InP Schottky diode structure and a method of making the same

A VLSI-compatible process for the manufacturing of a monolithic high-density electronic head in the form of a single composite IC chip for reading and/or writing multiple tracks of magnetically recordable information. The VLSI-compatible process comprises the steps of fabricating a digital signal process circuit as well as other desired circuit components on a substrate, then fabricating a plurality of read and/or write elements on the same substrate using a thin film technique. Because the silicon-based materials, which are used to replace the conventional magneto-resistant elements, show very little magneto-resistance effect at room temperature, a magnetically sensitive layer is provided which comprises a double-drain polycrystalline thin-films transistor (DTFT) to provide the required sensitivity. Furthermore, because no wire-bonding is required between the write or read head and the necessary circuitry components, IC chips providing very high density monolithic electronic heads can be manufactured using the VLSI-compatible process, and each of the chips contains a very large number, in the order of several hundred, of read and/or write elements, as well as the necessary and/or desired electronic circuits. A plurality of read/write elements can be assigned to a common track of data to improve the accuracy and sensitivity of data transmission, or each element can be assigned to a respective track of data.

High-density electronic head

Growing community of inventors

Hsinchu, Taiwan

Tan F Lei