Chisso Corporation

Tomoegawa Paper Co., Inc.

Tamio Kimura

Nobumasa Ohtake

Takaharu Nakano

Atsushi Koshimura

Yoshinori Akutsu

Takahiro Saho

Hirofumi Yasuda

Kazuhiro Takayanagi

Masayuki Tsuchida

Resin compositions for the inner coat of semiconductors which include

Resin composition for inner coat of semiconductor chip

A polysiloxane compound modified with two hydroxyl groups at the one end thereof and particularly suitable for improving the surface characteristics of resins prepared by polycondensation of a polyol with another polyfunctional compound, and a silicone-modified polyurethane having superior characteristics such as low frictional properties, water repellency, oil repellency, thrombosis resistance, etc. and also a process for producing the polyurethane are provided, which polysiloxane compound expressed by the formula ##STR1## wherein R represents H, Me (methyl) or Et (ethyl) and n represents an integer of 0 to 4,000, and which silicone-modified polyurethane is obtained from a compound having at least two isocyanate groups and a compound having at least two hydroxyl groups, and by using as a part of the compound having at least two hydroxyl groups, the polysiloxane compound of the above formula (I) in the urethane bond-forming reaction.

Polysiloxane containing hydroxyl groups and a silicone-modified

Growing community of inventors

Yokohama, Japan

Tamio Kimura