Tokyo Electron Limited

Tokyo Electron Limi Ted

Tamaki Takeyama

Hiroaki Chihaya

Einstein Noel Abarra

Toshio Hasegawa

Masato Shinada

Naotaka Noro

Manabu Nakagawasai

Shinji Orimoto

Katsuhito Hirose

Shinya Iwashita

Motoi Yamagata

Kazunaga Ono

Munehisa Futamura

Naoyuki Suzuki

There is provided a method for processing a substrate, comprising: preparing a substrate processing device including a rotatable stage on which a substrate is placed, a frozen heat transfer body fixed on a backside of the stage with a gap interposed therebetween and cooled to an extremely low temperature, a gas supply mechanism configured to supply to the gap a cooling gas for transferring a cold heat of the frozen heat transfer body to the stage, a rotation mechanism configured to rotate the stage, and a processing mechanism configured to process the substrate; preheating the stage such that a temperature of the stage reaches a steady cooling temperature within a fixed range; and after preheating, continuously processing a plurality of substrates by the processing mechanism while rotating the stage that has reached the steady cooling temperature in a state where a substrate having a specific temperature higher than or equal to room temperature is placed on the stage.

Method and device for substrate processing

A film thickness measurement apparatus includes: a stage that places a substrate having a film formed thereon and measures a thickness of the film in-situ in a film forming apparatus; a film thickness meter including a light emitter that emits light toward the substrate disposed on the stage and a light receiving sensor that receives the light reflected by the substrate for measuring the thickness of the film in-situ; a moving mechanism including a multi-joint arm that moves an irradiation point of the light on the substrate; a distance meter that measures a distance between the light receiving sensor and the irradiation point on the substrate; and a distance adjustor that adjusts the distance between the light receiving sensor and the irradiation point on the substrate.

Film thickness measuring apparatus and film thickness measuring method, and film forming system and film forming method

A film forming apparatusincludes a plasma generating mechanismcommonly used for plasmarizing a processing gas and a cleaning gas supplied into a processing vesselin which a vacuum atmosphere is formed; an exhaust deviceconfigured to evacuate an exhaust lineconnected to a processing gas discharge unitwhile the plasmarization of the cleaning gas is being performed by the plasma generating mechanism; a tankprovided at the exhaust line; and a valve Vwhich is provided at the exhaust linebetween the tankand the processing gas discharge unit. The valve Vis configured to be closed to reduce an internal pressure of the tankand opened to attract the plasmarized cleaning gas into the tankfrom a processing spacethrough the processing gas discharge unit

Film forming apparatus, cleaning method for film forming apparatus and recording medium

A substrate processing method using a substrate processing apparatus including: a process container holding a substrate to be processed therein; first gas supplying means having flow rate adjusting means for supplying a first process gas to the process container; and second gas supplying means supplying a second process gas to the process container, the substrate processing method including: a first step of controlling a flow rate of the first process gas to be a first flow rate by the flow rate adjusting means and supplying the first process gas in a first direction; a second step of discharging the first process gas from the process container; a third step of supplying the second process gas to the process container; and a fourth step of discharging the second process gas from the process container, in a repeated manner, wherein a step of stabilizing the flow rate of the process gas is set between a primary first step and a secondary first step performed subsequently to the primary first step.

Substrate processing method and recording medium

Growing community of inventors

Yamanashi, Japan

Tamaki Takeyama