Ebara Corporation

Takuya Tsushima

Toshio Yokoyama

Hirotaka Ohashi

Junitsu Yamakawa

Tomonori Hirao

Yoshitaka Mukaiyama

Takahiro Abe

Sho Tamura

Fumiya Okazaki

An aspect of the disclosure provides a substrate drying apparatus. The substrate drying apparatus includes: a gripping part, gripping an outer periphery part of a substrate that is square; a substrate nozzle, ejecting gas to the substrate gripped by the gripping part to dry the substrate; and a gripping part nozzle, ejecting gas to the gripping part to dry the substrate. The substrate nozzle is relatively movable with respect to the substrate in a first direction, and is able to eject the gas in the first direction toward the substrate. The gripping part nozzle is relatively movable with respect to the substrate in the first direction, and is able to eject the gas in a second direction intersecting with the first direction. The gripping part nozzle is disposed behind the substrate nozzle in the first direction.

Substrate drying apparatus

An adjusting system is controlled such that an arrangement of the substrate is adjusted based on detection by a first sensor, and a second sensor is controlled to detect a characteristic point formed in advance on a plate surface of the substrate, wherein the arrangement of the substrate has been adjusted based on the detection by the first sensor. Moreover, it is checked whether a position of the characteristic point detected by the second sensor is within an allowable range, and the adjusting system is controlled to adjust the arrangement of the substrate based on the detection by the second sensor when the position of the characteristic point detected by the second sensor is within the allowable range, and the attaching/detaching system is controlled to attach the substrate to the substrate holder after the arrangement of the substrate is adjusted based on the detection by the second sensor.

Substrate processing apparatus and substrate processing method

Provided is a substrate holding apparatus capable of appropriately holding a substrate. The substrate holding apparatus is suggested to hold a substrate including a portion to be plated that is exposed to a plating solution and an edge portion that is an area outside the portion to be plated. The substrate holding apparatus comprises a grasp module to come in contact with the edge portion of the substrate and thereby grasp the substrate, a suction module to attract the portion to be plated of the substrate by suction to hold the portion to be plated, and a protrusion provided at a position corresponding to the portion to be plated in the substrate, and protruding toward the substrate to be held by the substrate holding apparatus more than the suction module.

Substrate holding apparatus

A substrate attachment and detachment device appropriate for a double-sided holder is provided. The substrate attachment and detachment device is a device that holds a substrate in a substrate holder and/or releases the holding of the substrate using the substrate holder. The substrate holder includes a first frame and a second frame. The first frame and the second frame have openings, respectively. The device includes a substrate supporting unit that sandwiches the substrate between the first frame and the second frame. The substrate supporting unit includes a lower substrate supporter, and an upper substrate supporter. The lower substrate supporter is configured to come into contact with the substrate through the opening of the frame positioned on a lower side. The upper substrate supporter is configured to come into contact with the substrate through the opening of the frame positioned on an upper side.

Device that holds substrate in substrate holder and/or releases holding of substrate using substrate holder, and plating apparatus including the same

To provide a substrate holder and a plating apparatus that can easily position a substrate. A substrate holder includes a substrate holding body for holding a substrate, and a first holding member and a second holding member that interpose and hold the substrate holding body therebetween, and the first holding member includes an opening portion through which the plating target surface of the substrate is exposed, and a power supply member configured to be in contact with a plating target surface of the substrate.

Substrate holder and plating apparatus

A substrate processing device for processing a substrate, comprising an image sensor configured to detect positions of two corners on at least one diagonal of a substrate when the substrate is transferred to a predetermined position; an illuminating device that can be disposed so as to illuminate the two corners of the substrate on an opposite side of the substrate at the predetermined position relative to the image sensor; and a control device configured to determine the position of the substrate on the basis of the positions of the two corners, which are detected by the image sensor, the control device being configured to be capable of changing at least either light quantity or wavelength of output light of the illuminating device.

Substrate processing device, method for controlling substrate processing device, and storage medium storing a program

A substrate attachment/detachment device which clamps and holds a substrate by means of first and second retaining members of a substrate holder, the device comprising a first holder retainer configured to hold the first retaining member in a first posture; and a second holder retainer configured to be movable in a linear manner toward and away from the first holder retainer, capable of holding the second retaining member in the first posture and a second posture which is substantially orthogonal to the first posture, configured to push the second retaining member against the first retaining member in the first posture to lock the first and second retaining members to each other.

Substrate attachment/detachment device, plating device, control device for a substrate attachment/detachment device, and storage medium that stores a program for causing a computer to execute a method of controlling a substrate attachment/detachment device

A substrate processing device for processing a substrate, comprising: an image sensor for detecting positions of two corners on at least one diagonal line of a substrate when the substrate is moved to a predetermined position; an illuminating device that can be disposed so as to illuminate the two corners of the substrate on an opposite side of the substrate at the predetermined position to the image sensor; and a control device for determining the position of the substrate, based on the positions of the two corners detected by the image sensor.

Growing community of inventors

Tokyo, Japan

Takuya Tsushima