Lintec Corporation

Takuo Nishida

Toshio Sugizaki

Takashi Akutsu

Sou Miyata

Tomomi Fukaya

Akihito Yamada

Yosuke Koma

Misaki Sakamoto

Daisuke Tomita

Osamu Takeuchi

The semiconductor processing sheet of the present invention is a semiconductor processing sheet including a base material and a pressure sensitive adhesive layer provided on one surface of the base material, wherein the pressure sensitive adhesive layer contains an acrylic polymer (A) having a molecular weight distribution of 3.0 or less and an acrylic polymer (B) having a molecular weight distribution of more than 3.0; and a gel fraction of the pressure sensitive adhesive layer is 50 to 70%, and a number average molecular weight of a sol content thereof is 60,000 or more.

Semiconductor processing sheet

As a semiconductor-related-member processing sheet which can stably achieve to enhance the removability of the semiconductor-related-member processing sheet and to suppress the reliability degradation of members comprising chips manufactured from a semiconductor-related member using the semiconductor-related-member processing sheet, there is provided a semiconductor-related-member processing sheet, comprising a base material and a pressure sensitive adhesive layer provided on or above one surface of the base material, wherein the pressure sensitive adhesive layer comprises one or more types of energy ray polymerizable compounds having an energy ray polymerizable functional group, wherein at least one type of the energy ray polymerizable compounds is a polymerizable branched polymer that is a polymer having a branched structure, wherein a contact angle on a measurement target surface is 40&#xb0; or less when measured using a water droplet under an environment of 25&#xb0; C. and a relative humidity of 50%.

Sheet for semiconductor-related-member processing and method of manufacturing chips using the sheet

An adhesive sheet having high adhesion and removability, low metal corrosion, small outgas generation, and particularly suitable for adherence to an electronic part, which sheet includes an adhesive layer provided for at least one surface of a substrate sheet, in which a pressure-sensitive adhesive forming the adhesive layer includes a resin composition mainly formed of an acrylic copolymer obtained by blending a carboxyl group-free acrylic copolymer obtained by copolymerizing the following components (A) to (C) with (D) an isocyanate-based cross-linking agent: (A) 76.999 to 94.999% by mass of an alkyl(meth)acrylate; (B) 5.0 to 23.0% by mass of an ethylenically unsaturated group-containing morpholine-based compound; and (C) 0.001 to 1.5% by mass of a functional group-containing unsaturated monomer; and a ratio M2/M1 of the mole number (M2) of isocyanate groups in the component (D) to the mole number (M1) of functional groups in the component (C) is 1.5 to 15.0.

Adhesive sheet

There is provided an adhesive sheet comprising an adhesive base sheet, an adhesive layer, and a release sheet laminated in sequence from the adhesive base sheet. The release sheet comprises a release agent layer and a release base material laminated in sequence from the adhesive layer. A release force between the release sheet and the adhesive layer is decreased by an external stimulus.

Adhesive sheet and release sheet

A pressure-sensitive adhesive articleincludes a release sheetconstituted from a releasing agent layerand a base material, and a pressure-sensitive adhesive sheetconstituted from a pressure-sensitive adhesive layerand a pressure-sensitive adhesive sheet base. Such a pressure-sensitive adhesive articlehas a structure in which the pressure-sensitive adhesive sheetis laminated on the release sheetso that the pressure-sensitive adhesive layeris in contact with the releasing agent layer. The releasing agent layeris composed of a material containing substantially no silicone compound. The releasing agent layeris mainly composed of an elastomer and has a Young's modulus of 1.5 GPa or less. Preferred examples of the elastomer include polybutadiene rubber (especially, 1,4-polybutadiene rubber), polyisoprene rubber, and ethylene propylene rubber. The release sheethas excellent releasability and has little adverse effect on electric components and the like.

Release sheet and pressure-sensitive adhesive article

Provided is a release sheet which is non-silicone-based and has a good releasability from a layer of a pressure sensitive adhesive and which has a stable antistatic property without being influenced by the air environment and is free of bleeding out of ionic substances derived from an antistatic agent. The release sheet is prepared by providing an undercoat layer containing a polyurethane-based resin and 0.1 to 45% by mass of a lithium salt-based antistatic agent and a layer of a rubber-based release agent formed by coating and drying a liquid containing a release agent in order on a substrate.

Growing community of inventors

Saitama, Japan

Takuo Nishida