Hitachi-high-technologies Corporation

Hitachi, Ltd.

The University of Tokyo

Hitachi High-tech Electronics Engineering Co., Ltd.

Taketo Ueno

Atsushi Taniguchi

Toshifumi Honda

Yukihiro Shibata

Minori Noguchi

Toshihiko Nakata

Akira Hamamatsu

Shunichi Matsumoto

Hiroyuki Nakano

Sachio Uto

Takahiro Jingu

Yasuhiro Yoshitake

Yoshimasa Ohshima

Hisashi Hatano

Yukihisa Mohara

Seiji Otani

Takahiro Togashi

Shunji Maeda

Yuta Urano

Yuko Otani

Takahiko Suzuki

Masahiko Nakada

Tetsuya Matsui

Hideki Nakayama

Hiroshi Toshiyoshi

Takuya Takahashi

Shun'ichi Matsumoto

Kentaro Motohara

A defect inspection method includes irradiating a sample with laser, condensing and detecting scattered light beams, processing signals that detectors have detected and extracting a defect on a sample surface, and outputting information on the extracted defect. Detection of the scattered light beams is performed by condensing the scattered light beams, adjusting polarization directions of the condensed scattered light beams, mutually separating the light beams depending on the polarization direction, and detecting the light beams by a plurality of detectors. Extraction of the defect is performed by processing output signals from the detectors by multiplying each detection signal by a gain, discriminating between a noise and the defect, and detecting the defect.

Defect inspection device and defect inspection method

The present invention is suppressing the elongating phenomenon in the dark field image of defects in detecting a minute defect by using a dark field microscope. Provided is a method for detecting defects in which scattered light generated from the sample, is concentrated to form an image and is captured and processed to extract a defect to find the positional information of the defect, and the positional information is output, wherein an image of the scattered light that suppresses the occurrence of the elongating phenomenon is formed for which partial shielding of a component of the forward scattered light, that passes through a region near the outer edge of the field of view of the objective lens, and the positional information for the defect is found from a luminance signal for a defect that is extracted from a captured scattered light image that suppresses the occurrence of the elongating phenomenon.

Method and device for detecting defects and method and device for observing defects

A defect inspection apparatus includes: a seed light generator including a pulse signal generator that generates a pulse signal and a polarization modulator that outputs pulse light of any one of two polarization states orthogonal to each other in synchronization with the pulse signal output from the pulse signal generator; a wavelength converting unit including a branching mechanism that branches the pulse light output by the polarization modulator of the seed light generator using polarization and a converting unit that wavelength-converts the pulse light branched by the branching mechanism into beams of two different wavelengths, respectively; an illumination optical system that illuminates a surface of an inspected target material with the beams of the two different wavelengths converted by the wavelength converting unit; a detection optical system including a detecting unit that detects light generated by the beams of the two different wavelengths illuminated by the illumination optical system; and a signal processing system including a distributor that distributes a signal based on the light detected by the detecting unit of the detection optical system for each wavelength, on the basis of the pulse signal output from the pulse signal generator, and a defect determining unit that processes a signal based on the light distributed by the distributor and determines a defect.

Defect inspection apparatus and defect inspection method

In inspecting a substrate having a transparent oxide film or a metal film formed on a surface thereof by using a dark field type inspection apparatus installing a laser light source, an illuminating beam having a high coherence causes variations in reflection strength due to multiple interferences within the transparent oxide film or an interference of scattered beams due to the surface roughness of the metal film occurs and which leads to degradation in the sensitivity of defect detection. The present invention solves the problem by providing a low-coherence but high-brightness illumination using a highly directive broadband light source, and a system in which the conventional laser light source is simultaneously employed to selectively use the light sources, thereby enabling a highly sensitive inspection according to the condition of a wafer.

Method and apparatus for inspecting defect

A defect inspection device includes an irradiation unit for simultaneously irradiating different regions on a sample with illumination light under different optical conditions, the sample being predesigned to include patterns repeatedly formed thereupon, wherein the patterns are to be formed in the same shape; a detection unit for detecting, for each of the different regions, a beam of light reflected from each region irradiated with the illumination light; a defect candidate extraction unit for extracting defect candidates under the different optical conditions for each of the different regions, by processing detection signals corresponding to the reflected light which is detected; a defect extraction unit for extracting defects by integrating the defect candidates extracted under the different optical conditions; and a defect classifying unit for calculating feature quantities of the extracted defects and classifies the defects according to the calculated feature quantities.

Defect inspection method and device thereof

An optical filtering device and an optical inspection apparatus for detecting a defect in a high sensitivity using an optical filtering device which includes a shutter array formed in a two-dimensionally on an optically opaque thin film produced on a SOI wafer and the SOI wafer is removed at portions thereof on the lower side of the shutter patterns to form perforation portions while working electrodes are formed at the remaining portion of the SOI wafer, a glass substrate having electrode patterns formed on the surface thereof and having the shutter array mounted thereon, and a power supply section for supplying electric power to the electrode patterns formed on the glass substrate and the working electrodes of the SOI wafer. And the working electrodes is controlled to cause the shutter patterns to carry out opening and closing movements with respect to the perforation portions to carry out optical filtering.

Optical filtering device, defect inspection method and apparatus therefor

To prevent overlooking of a defect due to reduction in a defect signal, a defect inspection device is configured such that: light is irradiated onto an object to be inspected on which a pattern is formed; reflected, diffracted, and scattered light generated from the object by the irradiation of the light is collected, such that a first optical image resulting from the light passed through a first spatial filter having a first shading pattern is received by a first detector, whereby a first image is obtained; the reflected, diffracted, and scattered light generated from the object is collected, such that a second optical image resulting from the light passed through a second spatial filter having a second shading pattern is received by a second detector, whereby a second image is obtained; and the first and second images thus obtained are processed integrally to detect a defect candidate(s).

An invention being applied is a defect detecting apparatus that has: an illuminating optical system with a laser light source for irradiating a sample on whose surface a pattern is formed with light; a detecting optical system with a sensor for detecting light generated from the sample illuminated by the illuminating optical system; and a signal processing unit that extracts a defect from an image based on the light detected by the detecting optical system, in which an amplification rate of the sensor is dynamically changed during a time when the light is detected by the detecting optical system.

Defect inspecting apparatus and defect inspecting method

To effectively utilize the polarization property of an inspection subject for obtaining higher inspection sensitivity, for the polarization of lighting, it is necessary to observe differences in the reflection, diffraction, and scattered light from the inspection subject because of polarization by applying light having the same elevation angle and wavelength in the same direction but different polarization. According to conventional techniques, a plurality of measurements by changing polarizations is required to cause a prolonged inspection time period that is an important specification of inspection apparatuses. In this invention, a plurality of polarization states are modulated in micro areas in the lighting beam cross section, images under a plurality of polarized lighting conditions are collectively acquired by separately and simultaneously forming the scattered light from the individual micro areas in the individual pixels of a sensor, whereby inspection sensitivity and sorting and sizing accuracy are improved without reducing throughput.

Defect inspection method and apparatus therefor

A defect inspecting apparatus includes an irradiation optical system having a light source that emits illumination light and a polarization generation part that adjusts polarization state of the illumination light emitted from the light source, a detection optical system having a polarization analysis part that adjusts polarization state of scattered light from a sample irradiated by the irradiation optical system and a detection part that detects the scattered light adjusted by the polarization analysis part, and a signal processing system that processes the scattered light detected by the detection optical system to detect a defect presenting in the sample. The polarization generation part adjusts the polarization state of the illumination light emitted from the light source on the basis of predetermined illumination conditions and the polarization analysis part adjusts the polarization state of the illumination light emitted from the light source on the basis of predetermined detection conditions.

A method of inspecting defects and a device inspecting defects of detecting defects at high sensitivity and high capture efficiency even on various patterns existing on a wafer. In the device of inspecting defects, an illumination optical system is formed of two systems of a coherent illumination of a laserand an incoherent illumination of LEDsand, and light paths are divided in a detecting system corresponding to respective illumination light, spatial modulation elementsandare arranged to detecting light paths, respectively, scattered light inhibiting sensitivity is shielded by the spatial modulating elementsand, scattered light transmitted through the spatial modulation elementsandis detected by image sensorsandarranged to respective light paths, and images detected by these two image sensorsandare subjected to a comparison processing, thereby determining a defect candidate.

Method of defect inspection and device of defect inspection

By including an illumination system and a detection system, an information collecting function of monitoring an environment, such as temperature and atmospheric pressure, and an apparatus state managing function having a feedback function of comparing the monitoring result and a design value, a theoretical calculation value or an ideal value derived from simulation results and calibrating an apparatus so that the monitoring result is brought close to the ideal value, a unit for keeping the apparatus state and apparatus sensitivity constant is provided. A control unitis configured to include a recording unit, a comparing unit, a sensitivity predicting unit, and a feedback control unit. In the comparing unit, the monitoring result transmitted from the recording unitand an ideal value stored in a databaseare compared with each other. When a difference between the ideal value and the monitoring result exceeds a predetermined threshold, the feedback control unitcorrects the illumination system and the detection system.

Dark-field defect inspecting method, dark-field defect inspecting apparatus, aberration analyzing method, and aberration analyzing apparatus

A defect inspection system is disclosed for easily setting inspection conditions and providing an inspection condition and a defect signal intensity to an operator. The defect inspection system digitizes a defective image, and a reference image corresponding thereto and a mismatched portion of the defective image and the reference image as a defect signal intensity and accumulates them in association with the inspection condition. The inspection conditions are changed to repeat evaluations while repeating accumulating works until the evaluation of all the inspection conditions in a set range is completed. A recipe file including the accumulated conditions having the high defect signal intensity and an inspection condition item distribution as a inspection condition recipe is automatically outputted and provided to the operator.

Defect inspection system

A method and apparatus of detecting a defect by inspecting a specimen in which a surface of a specimen on which plural patterns are formed is illuminated with an elongated shape light flux from one of plural directions which are different in elevation angle by switching an optical path of the light flux emitted from an illuminating light source in accordance with a kind of defect to be detected. Plural optical images of the specimen illuminated by the elongated shape light flux are captured with plural image sensors installed in different elevation angle directions by changing an enlarging magnification in accordance with a density of the pattern formed on the sample in an area irradiated with the illuminating elongated shape light flux. A defect on the specimen is detected by processing the images captured by the plural image sensors.

Method of apparatus for detecting particles on a specimen

The present invention relates to a defect inspection system which can perform inspection condition setting easily in a relatively short period of time, can examine the inspection condition setting even when there is no sample, and further can provide an inspection condition and a defect signal intensity to a person, who sets the inspection condition, to assist the inspection condition setting. In the defect inspection system, a defective image, which is an inspection image, and a reference image corresponding thereto and a mismatched portion of the defective image and the reference image are digitalized as a defect signal intensity and accumulated in association with the inspection condition, and the inspection conditions are changed to repeat evaluations while repeating accumulating works until the evaluation of all the inspection conditions in a set range is completed. After all the evaluations are completed, if there are a plurality of defects to be inspected, the work is repeated by times corresponding to the number of kinds of the defects and a recipe file including the accumulated conditions having the high defect signal intensity and an inspection condition item distribution as a inspection condition recipe is automatically outputted and is provided to the person who sets the inspection condition. And, appearance inspection for detecting a pattern defect or a foreign material defect on a substrate is performed.

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Fujisawa, Japan

Taketo Ueno