Tokyo Electron Limited

Takehiko Arita

Hayato Sakai

Kei Kobayashi

Haruka Kaneko

Satoshi Suzuki

Shin Yamaguchi

Akiyoshi Mitsumori

Koichi Murakami

A temperature control medium processing apparatus configured to collect a temperature control medium from a module using the temperature control medium or refill the module with the temperature control medium includes a tank configured to store the temperature control medium therein; a first inlet path which is connected to a first inlet opening of the tank, and through which the temperature control medium is introduced; an inlet connector configured to connect the first inlet path and a path from the module; an outlet path which is connected to an outlet opening of the tank, and through which the temperature control medium is flown out; an outlet connector configured to connect the outlet path and a path to the module; and a pump provided at the outlet path, and configured to force the temperature control medium stored in the tank to be flown out.

Temperature control medium processing apparatus and temperature control medium processing method

A system of processing a substrate includes substrate-processing chambers; target components of temperature control disposed in the respective substrate-processing chambers; a chiller to supply a first temperature-controlling medium with a first flow rate and a second temperature-controlling medium with a second flow rate into the target components; flow controllers connected to the respective target components, each flow controller being configured to independently control a ratio of the first flow rate to the second flow rate to be fed into the corresponding target component from the chiller.

Substrate processing apparatus and substrate processing method

A temperature control fluid is introduced through a first port. The temperature control fluid introduced into the first port is discharged through a second port. A piston is configured to be moved by a pressure to open or close a path connecting the first port and the second port. A pressure control space is provided at at least one side of a moving direction of the piston when the path is opened or closed. Air is supplied into the pressure control space through a third port. A leak portion communicates with the pressure control space, and allows the air supplied into the pressure control space to leak therethrough.

Valve device

A cooling table includes a first portion, a second portion, a first path, a second path and a third path. An electrostatic chuck is provided on the first portion, and the first portion is provided on the second portion. The first path is provided within the first portion, and the second path is provided within the second portion. The third path is connected to the first path and the second path. A chiller unit is connected to the first path and the second path. The first path is extended within the first portion along the electrostatic chuck, and the second path is extended within the second portion along the electrostatic chuck. A coolant outputted from the chiller unit passes through the first path, the third path and the second path in sequence, and then is inputted to the chiller unit.

Processing apparatus for processing target object

A temperature control system includes a first pump, a second pump, a temperature adjusting unit, a first flow passage, a second flow passage, a first valve disposed in the first flow passage, a second valve disposed in the second flow passage, a first bypass flow passage connecting the first flow passage to the second flow passage on the temperature adjusting unit side of the first and second valves, a second bypass flow passage connecting the first flow passage to the second flow passage on the flow passage side of the first and second valves, a third valve disposed in the first bypass flow passage, and a fourth valve disposed in the second bypass flow passage. At least one of a pair of the first valve and the second valve, and a pair of the third valve and the fourth valve is a pair of flow rate adjustable valves.

Temperature control system including multiple valves and temperature control method

A cooling system includes a heat exchange unit; a supply line configured to send a coolant to the heat exchange unit; a drain line configured to send the coolant drained from the heat exchange unit; a first to a ngas-liquid separating units connected in series to a gas line in which a gas of the coolant flows; a first to a ncooling lines extended via the first to the ngas-liquid separating units, respectively. Both ends of the first cooling line are connected to a cooling device. The second to the ncooling lines are provided between the drain line and a first to a (n&#x2212;1)liquid lines via the second to the ngas-liquid separating units, respectively. The first to the ngas-liquid separating units are respectively connected to liquid lines, and the liquid lines communicate with the supply line connected to the heat exchange unit.

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Miyagi, Japan

Takehiko Arita