Jsr Corporation

Dsm IP Assets B.v.

Japan Fine Coatings Co. Ltd.

Other

Takayoshi Tanabe

Shin-ichiro Iwanaga

Eiichi Kobayashi

Takashi Ukachi

Yoshikazu Yamaguchi

Hideaki Takase

Tetsuya Yamamura

Makoto Shimizu

Atsushi Ito

Yong Wang

Yoshihisa Ohta

Akira Tsuji

Hirofumi Goto

Kazuo Kawaguchi

Shigehito Asano

Noriyasu Shinohara

Shinichiro Iwanaga

Satoshi Futami

Katsuyuki Takase

Shingo Itai

Hiroki Nakajima

Jiro Ueda

Jirou Ueda

Toshiaki Ikemura

Akihiko Sakurai

A photosensitive insulating resin composition includes a block copolymer, a crosslinking agent, a photosensitive compound, and a solvent. The block copolymer includes a first structural unit shown by a following formula (1) and a second structural unit shown by a following formula (2), wherein Rrepresents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and Rrepresents an alkyl group having 1 to 4 carbon atoms.

Photosensitive insulating resin composition, cured product thereof and ABA block copolymer

The present invention aims to provide a radiation-curing liquid resin composition for optical tridimensional modeling having good storage stability. The suitable radiation-curing liquid resin composition for optical tridimensional modeling of the present invention includes a compound represented by the below general formula (1), a compound having phenolic hydroxyl group, a cationic polymerizable compound, a radical polymerization initiator, a radical polymerizable compound, one or more sulfur compound selected from the group consisting of 2-mercaptobenzothiazole, 2-(4-morpholinodithiobenzothiazole, diisopropylxantogendisulfide and diphenyldisulfide, a polyether polyol compound. 

Radioactive ray-curable liquid resin composition for use in optical stereolithography, and optically shaped article produced by curing the composition

To provide a UV-curable resin composition useful for forming optical parts such as optical lenses. A radiation-curable resin composition for optical parts, comprising (A) 5&#x2013;70 wt % of urethane (meth)acrylate, (B) 0.1&#x2013;70 wt % of benzyl (meth)acrylate, and (C) 10&#x2013;70 wt % of an ethylenically unsaturated group-containing compound other than the components (A) and (B).

Radiation-curable resin composition for forming optical part and optical part

To provide a radiation-sensitive curable liquid resin composition having excellent applicability and capable of producing a film excelling in hardness, scratch resistance, adhesion, transparency, and appearance of the surface of the film. A curable liquid resin composition comprising: (A) particles prepared by bonding at least one oxide of an element selected from the group consisting of silicon, aluminum, zirconium, titanium, zinc, germanium, indium, tin, antimony, and cerium to a specific organic compound which comprises a polymerizable unsaturated group and a group shown by &#x2014;X&#x2014;C(&#x2550;Y)&#x2014;NH&#x2014; (wherein X is NH, O, or S, and Y is O or S), and preferably a silanol group, (B) a compound having two or more polymerizable unsaturated groups in the molecule, (C) a specific alkylene glycol organic solvent, and preferably (D) a polymerization initiator.

Curable liquid resin composition

The invention relates to a curable resin composition, cured products thereof, and laminated materials. The curable composition comprises: After cure, the composition has excellent scratch resistance. In addition, it may have excellent antistatic characteristics and transparency. In a preferred embodiment the composition also comprises (A-2) particles other than the acicular particles (A-1), being oxide of at least one element selected from the group consisting of silicon, aluminum, zirconium, titanium, zinc, germanium, indium, tin, antimony, and cerium.

Curable composition, cured product thereof, and laminated material

A photocurable resin composition suitable for use in three-dimensional photofabrication comprising (A) a cationically polymerizable organic compound, (B) a cationic photoinitiator, and (C) a (co)polymer obtainable by (co)polymerization of monomers comprising at least one (meth)acrylate-group comprising monomer. A process for producing a three-dimensional object which comprises the use of a washing agent having a Hansen-solubility between 27-35 (Mpa).

Resin composition and three dimensional object

The invention relates to a photocurable resin composition comprising: (A) a di or more functional urethane (meth)acrylate compound; (B) a monofunctional (meth)acrylate; (C) a photoinitiator; and (D) a polyoxyalkylene alkyl ether phosphate represented by the following formula (2):and to cured products obtained from the resins composition.

Photocurable resin composition and optical parts

Resin composition and three-dimensional object

A radiation sensitive resin composition comprising (A) a copolymer possessing recurring units of the formulas (1), (2), and (3),

Radiation sensitive resin composition

Positive as well as negative radiation sensitive resin compositions that, in addition to being capable of providing excellent resolution and pattern profile, are particularly excellent in avoiding the problems of 'nano-edge roughness' or 'coating surface roughness'. The positive type radiation sensitive resin composition comprises (A) (a) an acid-decomposable group-containing resin, or (b) an alkali-soluble resin and an alkali dissolution controller, and (B) a photoacid generator comprising 'a compound that upon exposure to radiation generates a carboxylic acid having a boiling point of 150.degree. C. or higher', and 'a compound that upon exposure to radiation generates an acid other than a carboxylic acid'. The negative type radiation sensitive resin composition comprises (C) an alkali-soluble resin, (D) a cross-linking agent, and the component (B) as described above.

A radiation-sensitive resin composition comprising (A) a copolymer which comprises (a) a repeating unit (I) formed by cleavage of a carbon--carbon double bond of a monomer having one polymerizable carbon--carbon double bond and (b) a repeating unit (II) formed by cleavage of a carbon--carbon double bond of a monomer having two or more polymerizable carbon--carbon double bonds and at least one divalent group decomposed by an acid of the following formulas (1) or (2), ##STR1## wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are an alkyl group having 1-5 carbon atoms or an aryl group having 6-14 carbon atoms individually, said monomer having a structure in which each carbon--carbon double bond combines via said divalent group, and (B) a photoacid generator. The radiation-sensitive resin composition exhibits excellent sensitivity and resolution, fewer effect from the swing curves, excellent pattern profile, and superior heat resistance, high sensitivity to ultraviolet rays, far ultraviolet rays, X-rays, and various types of radiation such as charged particle rays, and is useful as a chemically amplified positive tone resist used in the manufacture of integrated circuit devices.

Radiation-sensitive resin composition

A radiation sensitive resin composition useful as a chemically amplified positive tone resist is provided. The composition comprises (A) a copolymer which becomes soluble in an alkali developing solution by the action of an acid, the copolymer containing a recurring unit (I) having a structure which is decomposed by the action of an acid and increases the solubility in an alkaline developing solution and a recurring unit(II) obtained from a compound having at least two (meth)acryloyl groups in the molecule by the cleavage of the carbon-carbon double bond, and (B) a photoacid generator which produces an acid on being irradiated by a radiation. The composition exhibits high resolution, superb capability of producing superior pattern forms, and excellent resistance to PED, and high process stability, is affected by a standing wave only to a minimum extent, and possessed prominent heat resistance.

A radiation sensitive composition comprising (A) a copolymer comprising recurring units of a p-hydroxystyrene unit and a styrene unit having an acetal group or a ketal group at the p-position, (B) a copolymer comprising recurring units of a t-butyl (meth)acrylate unit and a p-hydroxystyrene unit, and (C) a radiation sensitive acid-generating agent.

Radiation sensitive composition

A positive-tone or negative-tone radiation sensitive resin composition which allows easy preparation of a resist, exhibits superior storage stability, high sensitivity, and high resolution capability, and is capable of producing excellent resist patterns. The positive-tone type composition comprises (A) a disulfonylmethane derivative in which the main chain with two sulfonyl groups bonded forms a three to eleven member cyclic carbon structure and (B) (a) a resin protected by an acid decomposable group or (b) an alkali-soluble resin and an alkali-solubility control agent. The negative-tone type composition comprises the component (A), (C) an alkali-soluble resin, and (D) a cross-linking agent.

Growing community of inventors

Ibaraki, Japan

Takayoshi Tanabe