Nitto-denko Corporation

Takatoshi Sasaki

Fumiteru Asai

Hiroki Fujioka

Akiyoshi Yamamoto

Tomokazu Takahashi

Toshio Shintani

Hirotoshi Ishizuka

Kouji Mizuno

Tsubasa Miki

Takayuki Toda

Provided is a pressure-sensitive adhesive tape for protecting a semiconductor that can satisfactorily fill an uneven surface and is prevented from an adhesive residue. The pressure-sensitive adhesive tape for protecting a semiconductor includes: a base material; a pressure-sensitive adhesive layer arranged on at least one side of the base material; and an intermediate layer arranged between the base material and the pressure-sensitive adhesive layer, wherein a storage modulus of elasticity A (MPa) of the pressure-sensitive adhesive layer, a thickness B (&#x3bc;m) of the intermediate layer, a thickness C (&#x3bc;m) of the pressure-sensitive adhesive layer, and a tack value D (N) of the pressure-sensitive adhesive layer satisfy the formula A&#xd7;(B/C)&#xd7;D&#x2265;20 (MPa&#xb7;N).

Pressure-sensitive adhesive tape for protecting semiconductor

A hydrophilized porous film which can be obtained through hydrophilizing by a simple method without impairing rejection performance and permeation performance and easily retains the properties of a film material, and to provide a process for producing the same. The hydrophilized porous film comprises a hydrophobic polymer and dispersed therein an organized clay which has been organized with a hydrophilic compound, and is obtained by a process including a step of dispersing a clay organized with a hydrophilic compound in a solution of a hydrophobic polymer and a step of subjecting this solution to phase separation to obtain the hydrophilized porous film.

Hydrophilized porous film and process for producing the same

Growing community of inventors

Ibaraki, Japan

Takatoshi Sasaki