Hitachi Chemical Company, Ltd.

Takashi Kumaki

Masahiro Miyasaka

Toshihiko Takasaki

Hiroshi Matsutani

Haruaki Sue

Iwao Fukuchi

Hideyasu Tsuiki

Makoto Kaji

Tatsuya Ichikawa

Hanako Yori

Junichi Iso

Takeshi Ohashi

Toshiki Ito

Manabu Saitou

Yasuhisa Ichihashi

A photosensitive element comprises a support, a photosensitive layer and a protective film laminated in that order, wherein the photosensitive layer is composed of a photosensitive resin composition containing a binder polymer, a photopolymerizing compound, a photopolymerization initiator and a compound with a maximum absorption wavelength of 370-420 nm, and the protective film is composed mainly of polypropylene.

Photosensitive element, method for formation of resist pattern, and method for production of print circuit board

A photosensitive resin composition comprising: (A) a binder polymer; (B) a photopolymerizable compound that has an ethylenically unsaturated bond; and (C1) a compound represented by general formula (1) below, wherein, at least one R represents a Calkoxy group or a Calkyl group; the sum of a, b, and c is 1 to 6; and when the sum of a, b, and c is 2 to 6, each R may be the same as or different from one another.

Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board

A photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizing compound with a polymerizable ethylenic unsaturated bond, (C) a photoradical polymerization initiator containing a 2,4,5-triarylimidazole dimer or its derivative, and (D) a compound represented by the following general formula (1) (wherein Rand Reach independently represent C1-20 alkyl, etc., and R, R, R, R, R, R, Rand Reach independently represent hydrogen, etc.).

Photosensitive resin composition, and, photosensitive element, method for forming resist pattern, method for manufacturing printed wiring board and method for manufacturing partition wall for plasma display panel using the composition

The present invention is a photosensitive element including a support and a photosensitive resin composition layer composed of a photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound, and (C) a photopolymerization initiator, wherein, 

Photosensitive element, resist pattern formation method and printed wiring board production method

The present invention discloses a sulfur-containing phenolic resin which comprises an organic group represented by the following formula (1):&#x2014;R&#x2014;S&#x2014;R&#x2014;S&#x2014;R&#x2014;&#x2003;&#x2003;(1) 

Sulfur-containing phenolic resin, process for preparing the same, phenol derivatives having thioether structure or disulfide structure, process for preparing the same and epoxy resin composition and adhesive

Disulfide-containing phenolic resin as curing agent for epoxy resin

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Hitachi, Japan

Takashi Kumaki