Renesas Electronics Corporation

Takashi Karashima

Satoshi Yamada

Shinji Baba

Kazuyuki Nakagawa

Masatoshi Yasunaga

Yuji Fujimoto

Kenya Hironaga

Yosuke Imazeki

Yumi Imamura

The terminal pattern TPof the wiring substrate PB has a side Tfacing the terminal pattern TPand the terminal pattern TPof the wiring substrate PB has a side Tfacing the side Tof the terminal pattern TP. The side Tand the side of Tare exposed from the opening portion OPand OPof the solder resist layer SRrespectively, and outer peripheries of terminal patterns TPand TPother than sides Tand Tare not exposed from opening portions OPand OP. The opening portion OPand the opening portion OPare separated from each other. The electrode Eof the capacitor Cis soldered to the terminal pattern TPexposed from the opening portion OP, and the electrode Eof the capacitor Cis soldered to the terminal pattern TPexposed from the opening portion OP

Semiconductor device including a chip capacitor mounted on a wiring substrate

An object of the present invention is to improve the reliability of a semiconductor device having an imaging function. A semiconductor device includes a package having a cavity and terminals (TE), a semiconductor chip that has an imaging unit and is arranged in the cavity, and a cap material with which the cavity is sealed and which has translucency. In addition, the semiconductor device includes a mounting board that has a through-hole and terminals (TE) and is arranged so as to electrically couple the terminals (TE) to the terminals (TE), a heat transfer member that is inserted into the through-hole and is coupled to the package, and a heat sink coupled to the heat transfer member.

Semiconductor device

Reliability of a semiconductor device is improved. In a flatness inspection of BGA (semiconductor device), there is formed a flatness standard where a permissible range in the direction of (+) of flatness at normal temperature is smaller than a permissible range in the direction of (&#x2212;). With use of the above flatness standard, a flatness inspection of the semiconductor device at normal temperature is performed to determine whether the mounted item is non-defective or defective. With the above process, defective mounting caused by a package warp when heated during reflow soldering etc. is reduced and reliability of BGA is improved. At the same time, flatness management of a substrate-type semiconductor device with better consideration of a mounting state can be performed.

Method of inspecting semiconductor device

To aim at improvement of reliability of a semiconductor device of flip chip connection type. In assembling a BGA of flip chip connection type, when a semiconductor chip is solder-connected by a flip chip connection, because solder precoat is formed on the surface of a land on the side of an undersurface of a wiring substrate, the connection between the land and a solder ball, which is an external terminal, is solder-connection, and therefore, it is possible to increase impact resistance of a connection part between the land and the solder ball and to aim at improvement of reliability of the BGA.

Growing community of inventors

Kanagawa, Japan

Takashi Karashima