Az Electronic Materials (luxembourg) S.a.r.l.

Merck Patent Gmbh

Az Electronic Materials USA Corp.

Sakai Display Products Corporation

Takashi Fuke

Toshiaki Nonaka

Daishi Yokoyama

Yuji Tashiro

Naofumi Yoshida

Yasuaki Tanaka

Katsuto Taniguchi

Takashi Sekito

Megumi Takahashi

Atsuko Noya

Nobutake Nodera

Takao Matsumoto

Masahiro Kato

Shinji Koiwa

Akihiro Shinozuka

Yuki Tashiro

Daishi Tokoyama

To provide a photosensitive siloxane composition capable of forming a pattern having a desired taper angle and a desired linewidth. [Means] The present invention provides a photosensitive siloxane composition comprising: a polysiloxane having a structure represented by the following formula (ia′): (L is an alkylene or phenylene), a photoactive agent, and a solvent.

Photosensitive siloxane composition and pattern forming method using the same

[Problem] To provide a positive type photosensitive polysiloxane composition that can manufacture a cured film having a high surface smoothness, in which generation of wrinkles is suppressed even without adding a curing auxiliary or performing flood exposure. [Means for Solution] A positive type photosensitive polysiloxane composition comprising (I) a polysiloxane, (II) a carboxylic acid compound that is a monocarboxylic acid or a dicarboxylic acid, of 200 to 50,000 ppm based on the total mass of the composition, (III) a diazonaphthoquinone derivative, and (IV) a solvent, and a method for manufacturing a cured film using the composition.

Positive type photosensitive polysiloxane composition

The present invention provides a positive type photosensitive siloxane composition in which a film formed by the same has high heat resistance, high strength and high crack resistance, an active matrix substrate in which by-product is not generated, an occurrence of defects is suppressed, and an interlayer insulating film is easily formed at a low cost while having good transmittance, a display apparatus including the active matrix substrate, and a method of manufacturing the active matrix substrate. An active matrix substrate includes a plurality of gate wirings provided so as to extend parallel to each other on an insulating substrate, and a plurality of source wirings provided so as to extend parallel to each other in a direction intersecting the respective gate wirings. An interlayer insulating film and a gate insulating film are interposed at portions including the intersecting portions of the gate wirings and the source wirings, on a lower side of the source wiring. The interlayer insulating film is formed using the positive type photosensitive siloxane composition without using a resist.

Positive type photosensitive siloxane composition, active matrix substrate, display apparatus, and method of manufacturing active matrix substrate

To provide a negative-working photosensitive siloxane composition developable inorganically, and also to provide a cured film-manufacturing method employing that. The present invention provides a negative-working photosensitive siloxane composition comprising a polysiloxane, a silicon-containing compound having an ureido bond, a polymerization initiator, and a solvent. This composition is coat on a substrate, exposed to light, and developed, so that a cured film can be obtained without carrying out post-exposure baking.

Negative-working photosensitive siloxane composition

A positive-type photosensitive siloxane composition which comprises (I) two or more polysiloxanes that differ in the rate of dissolution in aqueous tetramethylammonium hydroxide (TMAH) solutions, (II) a polysiloxane that gives a film which after prebaking has a rate of dissolution in 2.38 wt-% aqueous TMAH solution of 50-1,000 &#x212b;/sec and that has a group soluble in aqueous TMAH solution, other than silanol, (III) a diazonaphthoquinone derivative, and (IV) a solvent.

Positive-type photosensitive siloxane composition

[Problem] An object of the present invention is to provide a composite of metal oxide nanoparticles and a silsesquioxane polymer, which can form a high-quality cured film wherein aggregation and the like of metal oxide do not occur during a curing process and the metal oxide is uniformly dispersed. [Means for Solution] Provided are: a method of producing a composite of metal oxide nanoparticles and a silsesquioxane polymer, the method comprising reacting a silsesquioxane polymer having a silanol group at a terminal, or a silane monomer with metal oxide nanoparticles having a hydroxyl group or an alkoxy group on the surface in an aqueous solvent in the presence of a phase transfer catalyst; and a composite produced by the method.

Composite of metal oxide nanoparticles and silsesquioxane polymer, method for producing same, and composite material produced using composite thereof

[Object] To provide a negative-working photosensitive siloxane composition developable inorganically, and also to provide a cured film-manufacturing method employing that. [Means] The present invention provides a negative-working photosensitive siloxane composition comprising a polysiloxane, a silicon-containing compound having a pKa of 2.0 to 15.7, a photo-polymerization initiator, and a solvent. This composition is coat on a substrate, exposed to light, developed with an inorganic developer, and heated, so that a cured film can be obtained.

[Object] To provide a photosensitive siloxane resin composition excellent in alkali-solubility and in sensitivity, and also to provide a pattern-formation method employing that. [Means] The present invention provides a photosensitive siloxane resin composition comprising: a siloxane resin having silanol groups or alkoxysilyl groups, a crown ether, a photosensitive material, and an organic solvent. This photosensitive composition is cast on a substrate, subjected to imagewise exposure, treated with an alkali aqueous solution, and cured to form a pattern.

Photosensitive siloxane resin composition

A positive photosensitive siloxane composition comprising at least three types of following polysiloxanes (A), (B) and (C) obtained by hydrolyzing and condensing a silane compound represented by general formula (1) RSi (OR), a diazonaphthoquinone derivative, and a solvent: a polysiloxane (A) such that if pre-baked the film thereof will be soluble in a 5 weight % TMAH aqueous solution and the solution rate of said film will be 1,000 &#x212b;/sec or less; a polysiloxane (B) such that if pre-baked the solution rate of the film thereof will be 4,000 &#x212b;/sec or more relative to a 2.38 weight % TMAH aqueous solution; and a polysiloxane (C) such that if pre-baked the solution rate of the film thereof will be between 200 and 3,000 &#x212b;/sec relative to a 2.38 weight % TMAH aqueous solution. (In the formula, Rrepresents a C1-20 linear or branched cyclic alkyl group, in which any methylene may be substituted by oxygen, or a C6-20 aryl group, in which any hydrogen may be substituted by fluorine; n represents a 0 or a 1; and Rrepresents a C1-5 alkyl group.)

Positive photosensitive siloxane composition

[Object] To provide a coating composition excellent in coatability and free from viscosity increase caused by degradation over time, and also to provide a hardened film-formation method employing that. [Means] The present invention provides a coating composition comprising: a siloxane resin having silanol groups or alkoxysilyl groups, and a polyol having hydroxyl groups at both ends of a straight 2 to 5 carbon atom hydrocarbon chain. This coating composition enables to form a hardened film of high transparency, of high insulation and of low dielectricity.

Coating composition containing siloxane resin

A positive photosensitive siloxane composition containing: a polysiloxane (Ia), which is obtained by hydrolyzing and condensing the silane compound represented by RSi(OR)in general formula (1) and the silane compound represented by Si(OR)in general formula (2) in the presence of a basic catalyst, and a pre-baked film of which has a dissolution rate of 1,000 &#x212b;/second or less in a 5 wt % TMAH aqueous solution; a polysiloxane (Ib), which is obtained by hydrolyzing and condensing at least the silane compound represented by general formula (1) in the presence of an acid or basic catalyst, and a pre-baked film of which has a dissolution rate of 100 &#x212b;/second or more in a 2.38 wt % TMAH aqueous solution; and a diazonaphthoquinone derivative and solvent. (In the formula: R represents a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms, in which any methylene may be replaced by oxygen, or represents an aryl group having 6 to 20 carbon atoms, in which any hydrogen may be replaced by fluorine; and Ris an alkyl group having 1 to 5 carbon atoms.)

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Kakegawa, Japan

Takashi Fuke