Tokyo Electron Limited

Takashi Aiuchi

Michio Tanaka

Ryouichi Uemura

Makoto Kiyota

Kunie Ogata

Masanori Tateyama

Akihito Suzuki

Kazuhisa Sakamoto

Hirotsugu Kamamoto

Shuichi Yonemura

Takashi Imafu

An object of the present invention is to perform replacement of parts of a substrate processing apparatus more rapidly than that by the prior art. The present invention is a substrate processing apparatus constituted of a plurality of component parts for performing predetermined processing for a substrate, identification marks being attached to the respective component parts, the apparatus including: a storage unit for storing part information on each of the component parts necessary when placing an order for a component part, in correspondence with the identification mark; an input unit for inputting an identification mark of a component part to be ordered; and a display unit for displaying the part information in the storage unit corresponding to the inputted identification mark.

Substrate processing apparatus and carrier adjusting system

When a base film of a substrate is formed, for instance, on a scribe line of a wafer, a quadrangular first inspection pattern is formed in advance, and when a resist pattern is formed, a second inspection pattern are formed so as to be on a straight line to the first inspection pattern in a top plan view. When light is irradiated to a region including the first inspection pattern and the second inspection pattern and a spectrum is formed based on the reflected diffracted light, information of a line width of the second inspection pattern and a pitch of both inspection patterns is contained therein. In this connection, by preparing in advance a group of spectra based on various kinds of inspection patterns according to simulation and by comparing with an actual spectrum, the most approximate spectrum is selected, and thereby the line width and the pitch are estimated to evaluate the resist pattern.

Substrate inspecting device, coating/developing device and substrate inspecting method

The present invention is a managing system for managing a processing system of a substrate and it has an information accumulation section for accumulating information on the processing system, an information collecting unit for collecting the information from the information accumulation section, and a managing unit for obtaining the information in the information collecting unit via the Internet or an intranet to manage the processing system based on this information.

Managing system, managing method, host computer, and information collecting/transmitting unit

A system comprises a first maintenance interval storage for storing a first maintenance interval of each component which is not related to an actual utilization of an apparatus, a second maintenance interval storage storing a second maintenance interval of each component which is related to the actual utilization of the apparatus, a maintenance demander for demanding maintenance of some component based on the passing of the first maintenance interval of this component; and a maintenance interval prolonger for judging the second maintenance interval has passed or not based on the passing of the first maintenance interval, and when the second maintenance interval has not yet passed, suspending the demand for maintenance by the maintenance demander and prolonging the first maintenance interval. Consequently, it becomes possible to manage a maintenance timing of each component and give notice thereof on the side of the apparatus composed of a plurality of components.

Parts maintenance managing system

Growing community of inventors

Kumamoto, Japan

Takashi Aiuchi