Kabushiki Kaisha Toshiba

Ebara Corporation

Takamitsu Nagai

Yuichiro Yamazaki

Ichirota Nagahama

Mamoru Nakasuji

Masahiro Hatakeyama

Nobuharu Noji

Tohru Satake

Takeshi Murakami

Shoji Yoshikawa

Tsutomu Karimata

Motosuke Miyoshi

Hirosi Sobukawa

Kenji Watanabe

Toshifumi Kimba

Mutsumi Saito

Shin Oowada

Kazuyoshi Sugihara

Hiroyuki Hayashi

Kenichi Kadota

Tomonobu Noda

Hisaki Kozaki

Hiroshi Sobukawa

Akira Hamaguchi

Yuuichiro Yamazaki

An inspection apparatus by an electron beam comprises: an electron-optical devicehaving an electron-optical system for irradiating the object with a primary electron beam from an electron beam source, and a detector for detecting the secondary electron image projected by the electron-optical systems; a stage systemfor holding and moving the object relative to the electron-optical system; a mini-environment chamberfor supplying a clean gas to the object to prevent dust from contacting the object; a working chamberfor accommodating the stage device, the working chamber being controllable so as to have a vacuum atmosphere; at least two loading chambersdisposed between the mini-environment chamber and the working chamber, adapted to be independently controllable so as to have a vacuum atmosphere; and a loaderfor transferring the object to the stage system through the loading chambers.

Inspection system by charged particle beam and method of manufacturing devices using the system

An inspection apparatus by an electron beam comprises: an electron-optical devicehaving an electron-optical system for irradiating the object with a primary electron beam from an electron beam source, and a detector for detecting the secondary electron image projected by the electron-optical system; a stage systemfor holding and moving the object relative to the electron-optical system; a mini-environment chamberfor supplying a clean gas to the object to prevent dust from contacting to the object; a working chamberfor accommodating the stage device, the working chamber being controllable so as to have a vacuum atmosphere; at least two loading chambersdisposed between the mini-environment chamber and the working chamber, adapted to be independently controllable so as to have a vacuum atmosphere; and a loaderfor transferring the object to the stage system through the loading chambers.

A semiconductor substrate inspection method includes: generating a charged particle beam, and irradiating the charged particle beam to a semiconductor substrate in which contact wiring lines are formed on a surface thereof, the contact wiring lines of the semiconductor substrate being designed to alternately repeat in a plane view so that one of the adjacent contact wiring lines is grounded to the semiconductor substrate and the other of the adjacent contact wiring lines is insulated from the semiconductor substrate; detecting at least one of a secondary charged particle, a reflected charged particle and a back scattering charged particle generated from the surface of the semiconductor substrate to acquire a signal; generating an inspection image with the signal, the inspection image showing a state of the surface of the semiconductor substrate; and judging whether the semiconductor substrate is good or bad from a difference of brightness in the inspection image obtained from the surfaces of the adjacent contact wiring lines.

Semiconductor substrate, substrate inspection method, semiconductor device manufacturing method, and inspection apparatus

A substrate inspection apparatus includes: an electron beam irradiation device which emits an electron beam and causes the electron beam to irradiate a substrate to be inspected as a primary beam; an electron beam detector which detects at least one of a secondary electron, a reflected electron and a backscattered electron that are generated from the substrate that has been irradiated by the electron beam, and which outputs a signal that forms a one-dimensional or two-dimensional image of a surface of the substrate; a mapping projection optical system which causes imaging of at least one of the secondary electron, the reflected electron and the backscattered electron on the electron beam detector as a secondary beam; and an electromagnetic wave irradiation device which generates an electromagnetic wave and causes the electromagnetic wave to irradiate a location on the surface of the substrate at which the secondary beam is generated.

Substrate inspection apparatus, substrate inspection method and method of manufacturing semiconductor device

An electron beam inspection system of the image projection type includes a primary electron optical system for shaping an electron beam emitted from an electron gun into a rectangular configuration and applying the shaped electron beam to a sample surface to be inspected. A secondary electron optical system converges secondary electrons emitted from the sample. A detector converts the converged secondary electrons into an optical image through a fluorescent screen and focuses the image to a line sensor. A controller controls the charge transfer time of the line sensor at which the picked-up line image is transferred between each pair of adjacent pixel rows provided in the line sensor in association with the moving speed of a stage for moving the sample.

Electron beam inspection system and inspection method and method of manufacturing devices using the system

A method of determining defect detection sensitivity data, comprises: taking image data from the desired surface areas of each of semiconductor devices, processing at least two of the image data through arithmetic operations and comparing the processed image data with a parameter of defect detection sensitivity substituted by predetermined threshold data to obtain information on defects in the desired areas at least in one-to-one correspondence with any of the image data arithmetically processed, repeating more than once the step of varying the parameter of the defect detection sensitivity to obtain the defect information, so as to obtain more than one sets of combination data on a value of the parameter of the defect detection sensitivity correlated with the defect information, processing more than one sets of the combination data to produce a mathematical function expressing a relation of the desired statistical data with the parameter of the defect detection sensitivity, the mathematical function being used to determine defect detection sensitivity data, the defect detection sensitivity data being used in obtaining the information on the defects in the desired surface areas of the semiconductor devices under defect inspection, and the defect detection sensitivity data defining an existence range of the defect information in the image data which are taken from the desired surface areas of each semiconductor device and which are arithmetically processed in the previous step.

Method and apparatus for determining defect detection sensitivity data, control method of defect detection apparatus, and method and apparatus for detecting defect of semiconductor devices

Growing community of inventors

Kanagawa, Japan

Takamitsu Nagai