Adv Antest Corporation

Takaji Ishikawa

Tadao Saito

Shigeru Matsumura

Fumio Kurotori

Hiroyuki Hama

Hiroto Nakamura

Yoshihiro Abe

Masanori Kaneko

Noriaki Shimasaki

A probe card is provided which includes: probe needles electrically contacting input/output terminals of an IC device formed on a semiconductor wafer W; a mount base on which the probe needles are mounted; a support column supporting the mount base, a circuit board having interconnect patterns electrically connected to the probe needles via bonding wires; and a base member and stiffener for reinforcing the probe card. The mount base and the circuit board are noncontact.

Connection board, probe card, and electronic device test apparatus comprising same

A contact pin () for contacting a terminal of a wafer and supplying a signal to that wafer is provided with a first conductive layer () composed of a first conductive material having a relatively higher hardness than the oxide film formed on the terminal of the wafer, a second conductive layer () composed of a second conductive material having a relatively lower hardness than the oxide film, and a base material () with the first conductive layer () and second conductive layer () formed at the outside, the first conductive layer () being formed so as to closely contact the outside of the second conductive layer (), the first conductive layer () and second conductive layer () both being exposed at the front end face () of the contact pin ().

Contact pin probe card and electronic device test apparatus using same

A system for mating and demating a plurality of connectors mounted on a socket board with and from a plurality of corresponding connectors mounted on a motherboard includes: an adapter that is arranged above a surface opposite to the socket board surface on which the connectors are arranged and is movable in a direction in which the connectors are mated and demated; pressing means which contacts the surface of the socket board on which the semiconductor components are placed to press the socket board to the motherboard by lowering the adapter; and pulling means each of which engages with an engaging hole formed in the socket board and pulls the socket board in the direction in which the socket board is separated from the motherboard by lifting the adapter.

System for mating and demating multiple connectors mounted on board of semiconductor test apparatus

A probe cardis composed of a plurality of probe pinshaving wafer-side plungersat one end portion and substrate-side plungerson the other end side; two probe guidesandone above the other for supporting the plurality of probe pinsso that the plurality of probe pinsare arranged to be corresponding to an arrangement of external terminals of a semiconductor wafer and the wafer-side plungersof the probe pinsprotrude; a print substratehaving padsfor the substrate-side plungersof the probe pinssupported by the probe guidesandto contact; and a stiffenerprovided on the back surface of the print substrate

Probe card and the production method

To control the temperature of an electronic component testing socket without mixing any noise into a test signal to be applied to an electronic component and a respond signal to be read from the electronic component when conducting a test on the electronic component, a first spacein the electronic component testing socket baseand a socket body inside spacein the electronic component testing socketare connected via a gas outletand a gas inlet, and a second spacein the electronic component testing socket baseand a socket body inside spacein the electronic component testing socketare connected via a gas inletand a gas outlet

Growing community of inventors

Tokyo, Japan

Takaji Ishikawa