Tokyo Electron Limited

Takaharu Miyadate

Shuichi Takahashi

Takashi Taira

Naohiko Okunishi

Kenji Nagai

Akihiro Yokota

Takanori Banse

Nobutaka Sasaki

Etsuji Ito

Joji Takayoshi

Hideaki Nagasaki

Atsushi Ogata

Rumiko Moriya

Takaaki Kikuchi

Norinao Takasu

In a plasma processing apparatus, a table has a wafer support to hold a wafer and a peripheral segment surrounding the wafer support and having through-holes. The peripheral segment has an upper surface lower than that of the wafer support. An outer focus ring is disposed over the peripheral segment and has a recess or a cutout at an inner portion of the outer focus ring, and the recess or cutout has through-holes. An inner focus ring is disposed in the recess or cutout of the outer focus ring. Lift pins respectively extend through the through-holes of the peripheral segment and the through-holes of the recess or cutout of the outer focus ring. Shift mechanisms control shift of the respective lift pins.

Plasma processing apparatus

A substrate processing apparatus includes a process chamber, a stage that is disposed in the process chamber and on which a substrate is placeable, a moving mechanism, and a focus ring. The focus ring is disposed on the stage and includes an inner focus ring disposed close to the substrate placed on the stage, a middle focus ring that is disposed outside of the inner focus ring and is movable in a vertical direction by the moving mechanism, and an outer focus ring that is disposed outside of the middle focus ring.

Substrate processing apparatus

A substrate processing apparatus includes a stage, a light source, an optical assembly, a light receiver, and controller circuitry. The stage includes a first placing surface on which a substrate is to be placed, and a second placing surface that surrounds the first placing surface and on which a focus ring is to be placed. The optical assembly focuses light from the light source on a lower surface position, which is a position of a lower surface of the focus ring placed on the second placing surface. The light receiver receives light from the lower surface position. The controller circuitry detects at least one of a presence and an absence of the focus ring on the second placing surface, based on light received by the light receiver.

Apparatus for processing substrate and method for detecting a presence of a focus ring on a stage

A plasma processing apparatus includes a stage including a lower electrode in an inner space of a chamber main body. An upper electrode is provided above the stage. A first radio frequency power supply is electrically connected to the upper electrode through a power feed conductor. A second radio frequency power supply is electrically connected to a lower electrode. A ground conductor extends above the chamber main body to cover the upper electrode. The ground conductor provides an external space at the outside thereof on the side of the inner space. the third portion, the external space being provided on the second portion and above the inner space. The external space is spaced upward from the upper electrode and is shielded from the upper electrode by the ground conductor. An electromagnet is disposed in the external space.

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Miyagi, Japan

Takaharu Miyadate