Growing community of inventors

Saitama-ken, Japan

Takaei Sasaki

Average Co-Inventor Count = 3.43

ph-index = 2

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 24

Takaei SasakiNoriyuki Harashima (6 patents)Takaei SasakiSatoshi Aoyama (5 patents)Takaei SasakiShouichi Sakamoto (5 patents)Takaei SasakiTakaei Sasaki (6 patents)Noriyuki HarashimaNoriyuki Harashima (6 patents)Satoshi AoyamaSatoshi Aoyama (10 patents)Shouichi SakamotoShouichi Sakamoto (5 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Ulvac Coating Corporation (4 from 15 patents)

2. Mitsubishi Denki Kabushiki Kaisha (3 from 21,351 patents)

3. Other (2 from 832,680 patents)

4. Mitsubishi Denki Kabushiki (1 from 26 patents)


6 patents:

1. 7063922 - Method and apparatus for dry-etching half-tone phase-shift films, half-tone phase-shift photomasks and method for the preparation thereof, and semiconductor circuits and method for the fabrication thereof

2. 7001698 - Method and apparatus for dry-etching half-tone phase-shift films, half-tone phase-shift photomasks and method for the preparation thereof, and semiconductor circuits and method for the fabrication thereof

3. 6881991 - Dry-etching method and apparatus, photomasks and method for the preparation thereof, and semiconductor circuits and method for the fabrication thereof

4. 6844117 - Dry-etching method and apparatus, photomasks and method for the preparation thereof, and semiconductor circuits and method for the fabrication thereof

5. 6685848 - METHOD AND APPARATUS FOR DRY-ETCHING HALF-TONE PHASE-SHIFT FILMS HALF-TONE PHASE-SHIFT PHOTOMASKS AND METHOD FOR THE PREPARATION THEREOF AND SEMICONDUCTOR CIRCUITS AND METHOD FOR THE FABRICATION THEREOF

6. 6391791 - Dry-etching method and apparatus, photomasks and method for the preparation thereof, and semiconductor circuits and methods for the fabrication thereof

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as of
12/8/2025
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