Taiyo Nippon Sanso Corporation

Tadanobu Arimura

Akira Yamaguchi

Yoshio Ishihara

Masaya Yamawaki

The object of the present invention is to provide a cleaning apparatus for a component of a semiconductor production apparatus, which is capable of preventing the attachment of reaction products into the cleaning processing furnace by a simple structure, the present invention provides a cleaning apparatus () for a component of a semiconductor production apparatus including: a cleaning processing furnace () which is configured to house the component () of a semiconductor production apparatus; a heating device (); a gas introduction pipe (); a gas discharge pipe (); a decompression device (); a first temperature control device (); a second temperature control device (); and a purge gas supply device ().

Cleaning apparatus for component for semiconductor production apparatus, cleaning method for component of semiconductor production apparatus, and cleaning system for component of semiconductor production apparatus

A method which separates a component which is easily adsorbed by an adsorbent and a component which is not easily adsorbed by the adsorbent, from a feed gas which includes at least two kinds of components, with adsorption columns, wherein the adsorbent is filled in the adsorption columns and has strong adsorbability with respect to at least one kind of component included in the feed gas, and also has weak adsorbability with respect to at least one kind of other components included in the feed gas, and a temperature of the adsorbents which is filled in the column is maintained to be higher than the highest temperature of an ambient temperature around the adsorption columns which is variable throughout the year.

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Tsukuba, Japan

Tadanobu Arimura