Fujimi Incorporated

Other

Tadahiro Kitamura

Katsuyoshi Ina

Kenji Sakai

Hiroshi Asano

Satoshi Suzumura

Tsuyoshi Hasegawa

Kazusei Tamai

Yasuo Inada

Koji Ohno

Tsuyoshi Matsuda

Yuji Terashima

Noriko Miyairi

Takahiro Umeda

Tomohide Kamiya

A polishing composition comprising the following components (a) to (g):

Polishing composition and polishing method employing it

The method of polishing a copper layer of a substrate is capable of improving a stock removal rate, etc. The method comprises the steps of: supplying a substrate onto an polishing pad of an polishing plate with a copper layer facing the polishing pad; pressing the substrate onto the polishing pad, with a backing pad, by a press head; relatively rotating the press head with respect to the polishing plate, with supplying polishing slurry onto the polishing pad. The backing pad is made of a material whose Asker C hardness is 75-95 and whose compressibility is 10% or less. The polishing slurry includes a chelating agent for chelating copper, an etching agent for etching the surface of copper layer, an oxidizing agent for oxidizing the surface of copper layer, and water.

Method of polishing copper layer of substrate

Polishing composition and polishing process

A polishing composition comprising the following components:

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Aichi, Japan

Tadahiro Kitamura