Intel Corporation

Szyua S Liao

Patrick R Morrow

Rishabh Mehandru

Valluri Ramana Rao

Paul B Fischer

Kevin O'Brien

Kimin Jun

Bruce A Block

Doug B Ingerly

Integrated circuit cell architectures including both front-side and back-side structures. One or more of back-side implant, semiconductor deposition, dielectric deposition, metallization, film patterning, and wafer-level layer transfer is integrated with front-side processing. Such double-side processing may entail revealing a back side of structures fabricated from the front-side of a substrate. Host-donor substrate assemblies may be built-up to support and protect front-side structures during back-side processing. Front-side devices, such as FETs, may be modified and/or interconnected during back-side processing. Back-side devices, such as FETs, may be integrated with front-side devices to expand device functionality, improve performance, or increase device density.

Integrated circuit structures

Growing community of inventors

Portland, OR, United States of America

Szyua S Liao