Fujifilm Electronic Materials U.s.a., Inc.

Sung Tsai Lin

Yannan Liang

Liqing Wen

Shu-Wei Chang

Bin Hu

James McDonough

Hyosang Lee

Ting-Kai Huang

This disclosure features a polishing composition that includes at least one abrasive; at least one first corrosion inhibitor that includes a phosphate or a phosphonate group; at least one complexing agent; at least one second corrosion inhibitor that is at least one azole compound; and optionally a pH adjuster.

Polishing compositions and methods of use thereof

A slurry that polishes surfaces or substrates which includes cobalt. The slurry further comprises an anionic and/or cationic surfactant, each of which has a phosphate group, a long chain alkyl group, or both. The slurry also includes a corrosion inhibitor, abrasives, removal rate enhancers, solvents, pH adjustors, and chelating agents. The pH of the slurry is preferably 8 or higher.

Chemical mechanical polishing slurry for cobalt applications

Growing community of inventors

Taoyuan, Taiwan

Sung Tsai Lin