Taiwan Semiconductor Manufacturing Comp. Ltd.

Sung-Po Yang

Ding-I Liu

Kuo-Shu Tseng

Tung-Ching Tseng

Yu-Ying Lu

Feng-Tao Lee

Shih Fang Chen

Chung-Wen Chang

An apparatus for wafer processing includes a wafer pedestal configured to support a wafer, a radiation source configured to provide an electromagnetic radiation to the wafer, and a transparent window disposed between the wafer pedestal and the radiation source. The transparent window has a first zone having a first rough surface, and an Ra value of the first rough surface is between approximately 0.5 &#x3bc;m and approximately 100 &#x3bc;m. The apparatus for wafer processing further includes a primary reflector disposed in the radiation source, and a secondary reflector disposed between the transparent window and the radiation source. The rough surface can be provided over the transparent window, the primary reflector, and/or the secondary reflector.

Apparatus for wafer processing

A UV curing system includes an enclosure defining an interior, a UV radiation source disposed within the interior of the enclosure, and a first window disposed within the interior of the enclosure. The first window creates a barrier that separates the UV radiation source and a processing chamber. A second window is disposed within the interior of the enclosure at a distance from the first window to define a gas channel. The second window defines a plurality of openings such that the gas channel is in fluid communication with the processing chamber. A gas inlet conduit is in fluid communication with the gas channel and is configured to introduce a cooling gas into the gas channel. A gas outlet is in fluid communication with the processing chamber and is configured to remove gas from the processing chamber.

Gas delivery for uniform film properties at UV curing chamber

Growing community of inventors

Taoyuan County, Taiwan

Sung-Po Yang