Samsung Electronics Co., Ltd.

Sung Moon Park

Jong Woo Sun

Je Woo Han

Masayuki Tomoyasu

Ho Chang Lee

Kwang Nam Kim

Young Hoon Jeong

Jae Hoon Kim

Young Jin Noh

Hyung Kyu Choi

Jun Soo Lee

Seung Kyu Lim

Kyeong Seok Jeong

Yoshihisa Hirano

A plasma processing apparatus may include a lower electrode supporting a wafer; a focus ring surrounding an edge of the lower electrode and having a ring shape; and an edge ring disposed in a position lower than a position of the focus ring. The focus ring may include a lower region and an upper region disposed on the lower region, and the upper region increases in electrical conductivity as the upper region is closer to the lower region.

Plasma processing apparatus

A substrate processing apparatus including a process chamber; a susceptor in the process chamber; and an inner edge ring and an outer edge ring on the susceptor, wherein the inner edge ring includes a semiconductor, the outer edge ring includes an insulator, an upper surface of the outer edge ring is at a higher level than an upper surface of the inner edge ring, and the outer edge ring has an overhang extending onto the inner edge ring.

Substrate processing apparatus and method of processing a substrate

Substrate processing apparatus including edge ring

Growing community of inventors

Hwaseong-si, South Korea

Sung Moon Park