Samsung Electronics Co., Ltd.

Sung-Il Chang

Changhyun Lee

Byoungkeun Son

Chanjin Park

Youngwoo Park

Byeong-In Choe

Chang-seok Kang

Ju-Hyung Kim

Jin-Soo Lim

Changseok Kang

Jung-Dal Choi

Tae-young Kim

Yong-Seok Kim

Young-Woo Park

Su-Jin Ahn

Jun-Hee Lim

Chan Yong Park

Jae-Sung Sim

Ji-Yeong Hwang

Kwang Soo Seol

Jaegoo Lee

Chang-Seok Kang

Young Woo Park

Kye-Hyun Kyung

Jintaek Park

Jung-dal Choi

Chang Hyun Lee

Chul Bum Kim

Jae Goo Lee

Cheon-An Lee

Jongsun Sel

Jin-soo Lim

Three-dimensional semiconductor devices are provided. The three-dimensional semiconductor device includes a substrate, a buffer layer on the substrate. The buffer layer includes a material having an etching selectivity relative to that of the substrate. A multi-layer stack including alternating insulation patterns and conductive patterns is provided on the buffer layer opposite the substrate. One or more active patterns respectively extend through the alternating insulation patterns and conductive patterns of the multi-layer stack and into the buffer layer. Related fabrication methods are also discussed.

Three dimensional semiconductor devices

In a method of manufacturing a vertical semiconductor device, an insulation layer and a sacrificial layer are alternatively and repeatedly formed on a substrate to define a structure. The structure is etched to form a hole therethrough that exposes the substrate. A first semiconductor pattern is formed in a lower portion of the hole, and a blocking pattern, a charge storage pattern, a tunnel insulation pattern and a first channel pattern are formed on a sidewall of the hole. A second channel pattern is formed on the first channel pattern and the semiconductor pattern, and a second semiconductor pattern is formed on a portion of the second channel pattern on the semiconductor pattern to define an upper channel pattern including the second channel pattern and the second semiconductor pattern. The sacrificial layers are replaced with a plurality of gates, respectively, including a conductive material.

Vertical semiconductor devices and methods of manufacturing the same

A three-dimensional semiconductor device includes an upper structure on a lower structure, the upper structure including conductive patterns, a semiconductor pattern connected to the lower structure through the upper structure, and an insulating spacer between the semiconductor pattern and the upper structure, a bottom surface of the insulating spacer being positioned at a vertical level equivalent to or higher than an uppermost surface of the lower structure.

Semiconductor devices

Three-dimensional semiconductor devices

A method of manufacturing a semiconductor device includes forming a laminated structure including sacrificial layers and a select gate layer on a substrate, forming a penetration region penetrating the laminated structure, forming a select gate insulating layer on a sidewall of the select gate layer exposed by the penetration region, and forming an active pattern in the penetration region. The method also includes exposing a portion of the active pattern by removing the sacrificial layers and forming an information storage layer on the exposed portion of the active pattern.

Semiconductor memory device

Methods of fabricating three-dimensional semiconductor devices

A 3D semiconductor device includes an electrode structure has electrodes stacked on a substrate, semiconductor patterns penetrating the electrode structure, charge storing patterns interposed between the semiconductor patterns and the electrode structure, and blocking insulating patterns interposed between the charge storing patterns and the electrode structure. Each of the blocking insulating patterns surrounds the semiconductor patterns, and the charge storing patterns are horizontally spaced from each other and configured in such a way as to each be disposed around a respective one of the semiconductor patterns. Also, each of the charge storing patterns includes a plurality of horizontal segments, each interposed between vertically adjacent ones of the electrodes.

Three dimensional semiconductor memory devices and methods of fabricating the same

A non-volatile memory device may include a semiconductor substrate and an isolation layer on the semiconductor substrate wherein the isolation layer defines an active region of the semiconductor substrate. A tunnel insulation layer may be provided on the active region of the semiconductor substrate, and a charge storage pattern may be provided on the tunnel insulation layer. An interface layer pattern may be provided on the charge storage pattern, and a blocking insulation pattern may be provided on the interface layer pattern. Moreover, the block insulation pattern may include a high-k dielectric material, and the interface layer pattern and the blocking insulation pattern may include different materials. A control gate electrode may be provided on the blocking insulating layer so that the blocking insulation pattern is between the interface layer pattern and the control gate electrode. Related methods are also discussed.

Non-volatile memory devices including blocking insulation patterns with sub-layers having different energy band gaps

Three-dimensional semiconductor devices and methods of fabricating the same

A non-volatile memory device includes a substrate having an active region defined by a device isolation region that has a trench and an air gap, a device isolation pattern positioned at a lower portion of the trench, a memory cell layer including a tunnel insulation layer, a trap insulation layer and a blocking insulation layer that are sequentially stacked on the active region and one of which extends from the active region toward the device isolation region encloses top of the air gap whose bottom is defined by a layer other than that of the top, and a control gate electrode positioned on the cell structure. The one of the insulation layer extending includes a recess at a region corresponding to the center of the air gap.

Non-volatile memory device

Growing community of inventors

Hwaseong-si, South Korea

Sung-Il Chang