Ebara Corporation

Sumio Yabe

Kenya Ito

Takayuki Saito

Masaya Seki

Yuki Inoue

Kaoru Yamada

Ichiro Katakabe

Masayuki Kamezawa

A substrate processing apparatus and a substrate processing method is provided for performing a chemical liquid process, a cleaning process, a drying process, or the like while rotating a substrate such as a semiconductor wafer or a liquid crystal substrate. A substrate holding apparatus is provided for holding and rotating a substrate. The substrate processing apparatus for processing a substrate while supplying a fluid to the substrate includes a substrate holder for holding and rotating the substrate, and a holder suction unit for sucking the fluid from the substrate holder. The substrate holding apparatus includes a plurality of rollers which are brought into contact with an edge portion of a substrate so as to hold and rotate the substrate, and at least one moving mechanism for moving the rollers.

Substrate processing apparatus, substrate processing method, and substrate holding apparatus

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Tokyo, Japan

Sumio Yabe