International Business Machines Corporation

Globalfoundries Inc.

Sudesh Saroop

Mukta G Farooq

Emily R Kinser

Bhavana Bhoovaraghan

Carl John Radens

Rajiv V Joshi

Pranita Kerber

Rouwaida N Kanj

Antonio R Pelella

Pamela Castalino

Joseph P Walko

Peter W Schneider

Semiconductor fins are formed on a top surface of a substrate. A dielectric material is deposited on the top surfaces of the semiconductor fins and the substrate by an anisotropic deposition. A dielectric material layer on the top surface of the substrate is patterned so that the remaining portion of the dielectric material layer laterally surrounds each bottom portion of at least one semiconductor fin, while not contacting at least one second semiconductor fin. Dielectric material portions on the top surfaces of the semiconductor fins may be optionally removed. Each first semiconductor fin has a lesser channel height than the at least one second semiconductor fin. The first and second semiconductor fins can be employed to provide fin field effect transistors having different channel heights.

Multi-height fin field effect transistors

A method of testing a semiconductor substrate having through substrate vias for current leakage which includes: forming a current leakage measurement structure that includes substrate contacts, sensing circuits to sense current leakage from the through substrate vias, the sensing circuits connected to the through substrate vias and to the substrate contacts so that there is a one-to-one correspondence of a substrate contact and sensing circuit to each through substrate via, and a built-in self test (BIST) engine to sense one of the through substrate vias for current leakage. A reference current is applied to the sensing circuits to set a current leakage threshold for the through substrate vias. A through substrate via is selected for sensing for current leakage. The sensing circuit senses the selected through substrate via to determine whether there is current leakage from the selected through substrate via.

Leakage measurement of through silicon vias

A leakage measurement structure for through substrate vias which includes a semiconductor substrate; a plurality of through substrate vias in the semiconductor substrate extending substantially through the semiconductor substrate; and a leakage measurement structure located in the semiconductor substrate. The leakage measurement structure includes a plurality of substrate contacts extending into the semiconductor substrate; a plurality of sensing circuits connected to the plurality of through substrate vias and to the plurality of the substrate contacts, the plurality of sensing circuits providing a plurality of outputs indicative of current leakage from the plurality of through substrate vias; a built-in self test (BIST) engine to step through testing of the plurality of through substrate vias; and a memory coupled to the BIST engine to receive the outputs from the plurality of sensing circuits. Also included is a method of testing a semiconductor substrate.

Leakage measurement structure having through silicon vias

Disclosed are embodiments of a method, a system and a program storage device for simulating electronic device performance as a function of process variations. In these embodiments, functions of a primary model parameter for each of multiple secondary model parameters across multiple different process conditions can be determined based on a relatively small number of target sets of device characteristics. These functions can then be used to augment a simulator so that during subsequent simulations of the electronic device over a wide range of varying process conditions, a change in a value for the primary model parameter will automatically result in corresponding changes in values for the secondary model parameters. By augmenting the simulation environment in this manner, the disclosed embodiments efficiently provide more robust simulation results over prior art techniques.

Method, system and program storage device for simulating electronic device performance as a function of process variations

An integrated circuit can include an SRAM array having cells arranged in columns, each column being connected to true and complementary read local bitlines RLBLT and RLBLC. A local bit-select circuit can be connected to the cells of a column of the SRAM array, which can include first and second pull-down devices for pulling down a respective one of RLBLT and RLBLC at a timing controlled by a write control signal WRT. The circuit can include cross-coupled p-type field effect transistors ('PFETs') including a first PFET having a gate connected to RLBLT and having a drain connected to RLBLC, and a second PFET of the pair having a gate connected to RLBLC and having a drain connected to RLBLT. A first device can control a strength of the cross-coupled PFETs. A pair of cross-coupled n-type field effect transistors ('NFETs') can have gates connected to gates of the first and second pull-down devices. A second device can control a strength of the cross-coupled NFETs. The operation of the first and second devices can be controlled by applying first and second signals having programmed levels thereto. The levels of the first and second signals may selectively activate either the first device or the second device, so as to activate either the cross-coupled PFETs or the cross-coupled NFETs at one time.

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Poughkeepsie, NY, United States of America

Sudesh Saroop