Axcelis Technologies, Inc.

Stuart Rounds

Ivan Berry

Mahmoud Dahimene

Qingyuan Han

Robert Douglas Mohondro

Michael Owens

John Scott Hallock

A method of enabling the removal of fluorine containing residue from a semiconductor substrate comprising applying a gas and/or vapor to which the residue is reactive to the residue while the temperature of the substrate is at an elevated level with respect to ambient temperature and the residue is exposed to ultraviolet radiation, for a time period which is sufficient to effect at least one of volatilizing the residue or rendering the residue hydrophilic enough to be removable with deionized water.

Method of photoresist ash residue removal

A method of stripping a photoresist layer comprising applying a re-coating material on the photoresist layer which extends through and fills openings in a first layer on which the photoresist layer is disposed, ashing the stack comprised of the photoresist layer and the re-coating material, and removing such re-coating material as remains in the openings in the first layer after the ashing.

Method of stripping photoresist using re-coating material

Growing community of inventors

Frederick, MD, United States of America

Stuart Rounds