International Business Machines Corporation

Steven E Monahan

Robert D Johnson

Willard F Chandler

George M Gut

Ronald W Olson

LaVerne B Jacobson

Liquid abrasive slurry for chemical-mechanical polishing of semiconductor wafers is held on a rotating polish table by a containment device having two continuous circular bonded strips of differing flexibilities. A releasable clamp seals the entire length of the more flexible strip to the table periphery.

Slurry containment device for polishing semiconductor wafers

Pressurized liquid solvent is dispensed on specific areas of a semiconductor wafer. A vented accumulator removes bubbles introduced by an upstream needle valve. The accumulator outlet leads directly to a dispensing tip, without further pressure drop.

Method and apparatus for removing vapor from a pressurized sprayed

An anode for a reactive ion etching (RIE) system has a plurality of holes formed therethrough. The holes produce a plasma glow about each hole which results in an increase in the etch rate of wafers to be etched on a cathode opposite the holes. The holes are arranged in the anode to provide a uniform etch rate on one wafer or a batch of wafers to be etched. By varying the pressure in the system, the presence of plasma glow and hence the etch rate uniformity is controlled.

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Rochester, MN, United States of America

Steven E Monahan