Applied Materials, Inc.

Steven E Gianoulakis

Karthik Janakiraman

Nitin K Ingle

Zheng Yuan

Lawrence Chung-Lai Lei

Won B Bang

Reginald Hunter

Yen-Kun Victor Wang

Siqing Lu

Joel Brad Bailey

David Sun

Techniques of the present invention are directed to distribution of deposition gases onto a substrate. In one embodiment, a gas distributor for use in a processing chamber is provided. The gas distributor includes a body having a gas deflecting surface and a gas distributor face. The gas deflecting surface defines a cleaning gas pathway. The gas distributor face is disposed on an opposite side of the body from the gas deflecting surface and faces toward a substrate support member. The gas distributor face includes a raised step and at least one set of apertures through the raised step. The at least one set of apertures are adapted to distribute a deposition gas over a substrate positioned on the substrate support member.

Gas baffle and distributor for semiconductor processing chamber

A method of processing a semiconductor workpiece. The method includes flowing a process gas to a semiconductor workpiece through a first plurality of orifices positioned in a gas distribution faceplate. The method also includes removing gas from over the semiconductor workpiece through a chamber exhaust port and a second plurality of orifices positioned in the gas distribution faceplate.

Gas distribution showerhead featuring exhaust apertures

Embodiments of the present invention are directed to relieving the stresses caused by a mismatch in the coefficients of thermal expansion in the components forming the connections at the terminals of a heater. In one embodiment, a heater comprises a heater body having an electrical heating element and a bottom surface, and a rod configured to be coupled with an electrical power source. A plug has a first end which is coupled to the heater body and extends into the heater body through the bottom surface of the heater body, and which is electrically connected with the electrical heating element. The plug has a second end which includes a cavity to receive a portion of the rod. The cavity is surrounded by a slotted side wall of the plug which is disposed outside of the heater body and includes a plurality of slots extending from the second end toward the bottom surface of the heater body and terminating near the bottom surface but before reaching the bottom surface. The slotted side wall is connected with the rod received into the cavity. The rod and the plug have different coefficients of thermal expansion.

Low residual-stress brazed terminal for heater

A gas distribution showerhead for use in a semiconductor fabrication process features a face plate having gas outlet ports in the form of elongated slots or channels. The use of elongated gas outlet ports in accordance with embodiments of the present invention substantially reduces the incidence of undesirable spotting and streaking of deposited material where the showerhead is closely spaced from the wafer. A showerhead featuring a face plate having a tapered profile to reduce edge thickness of deposited material at close face plate-to-wafer spacings is also disclosed.

Gas distribution showerhead

Embodiments of the invention generally provide an apparatus for removing particles from a substrate surface, wherein the apparatus includes a substrate support member configured to support a substrate thereon, and a broadband actuator in mechanical communication with the substrate support member. Additionally, an air knife assembly may be positioned proximate a perimeter of the substrate surface, and is configured to deliver a laminar stream of air across the substrate surface in order to remove the dislodged contamination particles therefrom. Alternatively, a plasma source may be used to remove dislodged particles from the area proximate the substrate surface.

Growing community of inventors

Pleasanton, CA, United States of America

Steven E Gianoulakis