Sharp Kabushiki Kaisha Corporation

Steven Droes

Yutaka Takafuji

Yasumori Fukushima

Kazuhide Tomiyasu

Michiko Takei

A device portion forming step includes an assisting layer forming step of forming a planarization assisting layer, which covers a plurality of conductive films, over a first planarizing layer before forming a second planarizing layer. In the assisting layer forming step, the planarization assisting layer is formed so that a height of the planarization assisting layer from a surface of the first planarizing layer located on a side opposite to the substrate layer becomes equal between at least a part of a region where the conductive films are formed, and at least a part of a region where no conductive film is formed.

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Osaka, Japan

Steven Droes