The Boc Group, Inc.

Ford Motor Company Limited

Stephen C Schulz

Peter A Sieck

John L Vossen

Russell J Hill

Franklin I Brown

Terry A Trumbly

Richard L Newcomb

An elongated anode structure having multiple points to which electrons are attracted is provided. The anode can be constructed of multiple wire brushes that are attached to a metal rod. Use of the anode in magnetron systems significantly reduces dielectric material build-up and improves film uniformity in both dc reactive and non-reactive sputtering. Moreover, the anode reduces overheating and increases the operation time of magnetron systems undergoing reactive sputtering of dielectric materials. In one embodiment, the magnetron system has a cylindrical cathode and a pair of elongated anodes positioned parallel to and equidistance from the cathode. The anode structure is particularly suited for sputtering uniform films of dielectric materials, including silicon dioxide and silicon nitride.

Anode structure for magnetron sputtering systems

In one group of embodiments, two or more small anodes are spaced apart from one another in a magnetron, with some aspect of their electrical power being individually controlled in a manner to control a density profile across a plasma. In another group of embodiments, the same effect is obtained by mechanically moving one or more small anodes or anode masks. When used in a magnetron having either a rotating cylindrical cathode or a stationary planar cathode and designed to sputter films of material onto a substrate, the uniformity of the rate of deposition across the substrate is improved. Also, adverse effects of sputtering dielectric materials are reduced.

Use of multiple anodes in a magnetron for improving the uniformity of

Low transparency, or colored, copper oxide is taught as a new electrochromic material, in combination with a metallic oxide. The material is formed by application of the copper oxide to a substrate followed by application of the metallic oxide. A low-E glass substrate is heated, and cupric acetylacetonate powder is sprayed at the glass; the cupric acetylacetonate powder is atomized with dry oxygen. The glass/SN.sub.N O.sub.2 F/Cu.sub.x O system is then re-heated. After reheating, tungsten hexachloride dissolved in N,N-dimethyl formamide is sprayed at the copper oxide on the substrate. In a sample material, visible transmission is improved from 33% for copper oxide alone, to 65%.

Low transparency copper oxide coating for electrochromic device

A pyrolitic deposition process, for pyrolitic deposition of organo-cupric powder to form copper oxide film, is improved. A substrate is heated, and organocupric powder is sprayed at the substrate, using oxygen gas as the carrier gas. Up to one-third greater deposition rate results, as compared to the process using compressed air as the carrier gas.

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Benicia, CA, United States of America

Stephen C Schulz