Tokyo Electron Limited

Stefan Sawusch

Junichi Sasaki

Toshifumi Nagaiwa

A method of supplying and controlling the flow of a process gas to a process chamber. The method includes initiating a known flow rate of a process gas to a process chamber, dividing the known flow rate of the process gas into a first flow of the process gas at a first flow rate and a second flow of the process gas at a second flow rate, measuring a first pressure associated with the first flow of the process gas, measuring a second pressure associated with the second flow of the process gas, and controlling the first flow rate and the second flow rate according to a target flow condition by adjusting a first conductance of the first flow of the process gas and a second conductance of the second flow of the process gas and monitoring the first pressure and the second pressure.

Flow control method for multizone gas distribution

A method for adjusting the lateral critical dimension (i.e., length and width) of a feature formed in a layer on a substrate using a dry etching process. One or more thin intermediate sub-layers are inserted in the layer within which the feature is to be formed. Once an intermediate sub-layer is reached during the etching process, an etch process is performed to correct and/or adjust the lateral critical dimensions before etching through the intermediate sub-layer and continuing the layer etch.

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Pirna, Germany

Stefan Sawusch