Globalfoundries Inc.

Globalfoundries Singapore Pte. Ltd.

Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Namlab Ggmbh

Stefan Flachowsky

Jan Hoentschel

Thilo Scheiper

Ralf Illgen

Peter Javorka

Ralf Richter

Ricardo Pablo Mikalo

Matthias Kessler

Tim Baldauf

Roman Boschke

Tom Herrmann

Shiang Yang Ong

Steven Langdon

Gerd Zschaetzsch

Andy C Wei

Martin Gerhardt

Nicolas Sassiat

Gerd Zschätzsch

Maciej Wiatr

Ran Yan

Clemens Fitz

Dominic Thurmer

Johannes Mueller

Stefan Mueller

Sven Beyer

Thomas Feudel

Alban Zaka

Frank Wirbeleit

Martin Trentzsch

Kerstin Ruttloff

Stephan-Detlef Kronholz

Christian Schippel

Elke Erben

Ina Ostermay

Gerd Zschaezsch

Tom Hermann

Axel Henke

An illustrative device disclosed herein includes a semiconductor substrate. The substrate includes a source region, a drain region and a channel region. The channel region is arranged between the source region and the drain region. A gate insulation layer is provided over the channel region. A floating gate electrode is provided over the gate insulation layer. A layer of a ferroelectric material is provided over the floating gate electrode. A top electrode is provided over the layer of ferroelectric material. A projected area of the top electrode onto a plane that is perpendicular to a thickness direction of the semiconductor substrate is smaller than a projected area of the floating gate electrode onto the plane.

Device including a floating gate electrode and a layer of ferroelectric material and method for the formation thereof

A semiconductor device includes a plurality of spaced apart fins, a dielectric material layer positioned between each of the plurality of spaced apart fins, and a common gate structure positioned above the dielectric material layer and extending across the fins. A continuous merged semiconductor material region is positioned on each of the fins and above the dielectric material layer, is laterally spaced apart from the common gate structure, extends between and physically contacts the fins, has a first sidewall surface that faces toward the common gate structure, and has a second sidewall surface that is opposite of the first sidewall surface and faces away from the common gate structure. A stress-inducing material is positioned in a space defined by at least the first sidewall surface, opposing sidewall surfaces of an adjacent pair of fins, and an upper surface of the dielectric material layer.

Three-dimensional transistor with improved channel mobility

The present disclosure provides in one aspect a semiconductor device including a substrate structure comprising an active semiconductor material formed over a base substrate and a buried insulating material formed between the active semiconductor material and the base substrate, a ferroelectric gate structure disposed over the active semiconductor material in an active region of the substrate structure, the ferroelectric gate structure comprising a gate electrode and a ferroelectric material layer, and a contact region formed in the base substrate under the ferroelectric gate structure.

NVM device in SOI technology and method of fabricating an according device

A semiconductor device includes a semiconductor substrate and a fin positioned above the semiconductor substrate, wherein the fin includes a semiconductor material. Additionally, a ferroelectric high-k spacer covers sidewall surfaces of the fin and a non-ferroelectric high-k material layer covers the ferroelectric high-k spacer and the fin, wherein a portion of the non-ferroelectric high-k material layer is positioned on and in direct contact with the semiconductor material at the upper surface of the fin.

Ferroelectric FinFET

A semiconductor-on-insulator wafer includes a support substrate, an electrically insulating layer over the support substrate and a semiconductor layer over the electrically insulating layer. A semiconductor structure includes a transistor. The transistor includes an electrically insulating layer including a piezoelectric material over a support substrate, a semiconductor layer over the electrically insulating layer, a source region, a channel region and a drain region in the semiconductor layer, a gate structure over the channel region, a first electrode and a second electrode. The first electrode and the second electrode are provided at laterally opposite sides of the electrically insulating layer. The first and second electrodes are electrically insulated from the semiconductor layer and configured for applying a voltage to the piezoelectric material of the electrically insulating layer. The piezoelectric material creates a strain at least in the channel region in response to the voltage applied thereto.

Semiconductor-on-insulator wafer, semiconductor structure including a transistor, and methods for the formation and operation thereof

A semiconductor structure includes a semiconductor substrate, a layer of electrically insulating material above the semiconductor substrate, and a layer of semiconductor material above the layer of electrically insulating material. A first transistor includes a first source region, a first drain region, and a first channel region formed in the semiconductor substrate, a first gate insulation layer positioned above the first channel region, and an electrically conductive first gate electrode, wherein the first gate insulation layer includes a first portion of the electrically insulating material. A second transistor includes a second source region, a second drain region, and a second channel region formed in the layer of semiconductor material, a second gate insulation layer positioned above the second channel region, and an electrically conductive second gate electrode, wherein a second portion of the layer of electrically insulating material is positioned below the second channel region.

Semiconductor structure including a first transistor and a second transistor

A method disclosed herein includes providing a semiconductor structure, the semiconductor structure comprising a semiconductor substrate and a gate stack, the gate stack comprising a gate insulation material over the substrate, a floating gate electrode material over the gate insulation material, a ferroelectric transistor dielectric over the floating gate electrode material and a top electrode material over the ferroelectric transistor dielectric, performing a first patterning process to remove portions of the top electrode material and the ferroelectric transistor dielectric and performing a second patterning process after the first patterning process to remove portions of the floating gate electrode material and the gate insulation material, wherein a projected area of an upper portion of the gate structure onto a plane that is perpendicular to a thickness direction of the substrate is smaller than a projected area of the lower portion of the gate structure onto the plane.

Method of forming a device including a floating gate electrode and a layer of ferroelectric material

A method includes providing a semiconductor-on-insulator structure including a semiconductor substrate, a layer of electrically insulating material over the semiconductor substrate and a layer of semiconductor material over the layer of electrically insulating material. A first transistor is formed. The formation of the first transistor includes forming a dummy gate structure over the layer of semiconductor material, forming a source region of the first transistor and a drain region of the first transistor in portions of the semiconductor substrate adjacent the dummy gate structure, forming an electrically insulating structure annularly enclosing the dummy gate structure and performing a replacement gate process. The replacement gate process includes removing the dummy gate structure and a portion of the layer of semiconductor material below the dummy gate structure, wherein a recess is formed in the electrically insulating structure. The recess is filled with an electrically conductive material.

Method including a formation of a transistor and semiconductor structure including a first transistor and a second transistor

The present disclosure relates to a semiconductor structure comprising a positive temperature coefficient thermistor and a negative temperature coefficient thermistor, connected to each other in parallel by means of connecting elements which are configured such that the resistance resulting from the parallel connection is substantially stable in a predetermined temperature range, and to a corresponding manufacturing method.

Temperature independent resistor

E-fuses are used in integrated circuits in order to permit real-time dynamic reprogramming of the circuit after manufacturing. An e-fuse is hereby proposed wherein the metal element adapted to be blown upon passage of a current is not comprised of a silicide layer but is rather a metal layer above which a semiconductor layer is formed. A dielectric layer is then formed on the semiconductor layer, in order to prevent metal silicide from forming over the metal layer. The process of manufacturing the e-fuse can be easily integrated in an HKMG manufacturing flow. In particular, fully silicided metal gates may be manufactured in conjunction with the e-fuse, without jeopardizing the correct functioning of the e-fuse.

E-fuse design for high-K metal-gate technology

Lithographic limitations on gate and induced channel length in MOSFETS are avoided by forming non-planar MOSFETS in a cavity extending into a semiconductor substrate. The gate insulator and channel region lie proximate a cavity sidewall having angle &#x3b1; preferably about &#x2267;90 degrees with respect to the semiconductor surface. The channel length depends on the bottom depth of the cavity and the depth from the surface of a source or drain region adjacent the cavity. The corresponding drain or source lies at the cavity bottom. The cavity sidewall extends therebetween. Neither depth is lithographic dependent. Very short channels can be consistently formed, providing improved performance and manufacturing yield. Source, drain and gate connections are brought to the same surface so that complex circuits can be readily constructed. The source and drain regions are preferably formed epitaxially and strain inducing materials can be used therein to improve channel carrier mobility.

Canyon gate transistor and methods for its fabrication

Disclosed herein are various semiconductor devices with dual metal silicide regions and to various methods of making such devices. One illustrative method disclosed herein includes the steps of forming an upper portion of a source/drain region that is positioned above a surface of a semiconducting substrate, wherein the upper portion of the source/drain region has an upper surface that is positioned above the surface of the substrate by a distance that is at least equal to a target thickness of a metal silicide region to be formed in the upper portion of the source/drain region and forming the metal silicide region in the upper portion of the source/drain region.

Methods of making transistor devices with elevated source/drain regions to accommodate consumption during metal silicide formation process

A semiconductor device is provided including a semiconductor substrate and a nanowire formed over the semiconductor substrate and wherein the nanowire includes a first layer exhibiting tensile stress and a second layer exhibiting compressive stress.

Methods of forming a nanowire transistor device

The present disclosure provides in one aspect for a semiconductor device structure which may be formed by providing source/drain regions within a semiconductor substrate in alignment with a gate structure formed over the semiconductor substrate, wherein the gate structure has a gate electrode structure, a first sidewall spacer and a second sidewall spacer, the first sidewall spacer covering sidewall surfaces of the gate electrode structure and the sidewall spacer being formed on the first sidewall spacer. Furthermore, forming the semiconductor device structure may include removing the second sidewall spacer so as to expose the first sidewall spacer, forming a third sidewall spacer on a portion of the first sidewall spacer such that the first sidewall spacer is partially exposed, and forming silicide regions in alignment with the third sidewall spacer in the source/drain regions.

Method of forming a semiconductor device structure and such a semiconductor device structure

The present disclosure provides, in a first aspect, a semiconductor device, including a semiconductor substrate and a gate structure formed over the semiconductor substrate, wherein the gate structure comprises a fin and a ferroelectric high-k material formed at least over sidewall surfaces of the fin. Herein, a first thickness defined by a thickness of the ferroelectric high-k material formed over sidewalls of the fin is substantially greater than a second thickness defined by a thickness of the ferroelectric high-k material formed over an upper surface of the fin.

Growing community of inventors

Dresden, Germany

Stefan Flachowsky