Siemens Aktiengesellschaft

Spyridon Gisdakis

Helmut Horst Tews

Joachim Hoepfner

Michaela Zellner

Peter Zwicknagl

Method for the implantation of dopant into semiconductor material, whereby a reaction gas, for example fluorine, is conducted from a gas bottle via valves and mass flow regulator into a recipient into which dopant or a chemical compound of dopant has been introduced in solid form, so that the reaction gas reacts with the dopant to form a gaseous chemical compound, and this gas is subsequently forwarded into an apparatus for the implantation. A plurality of gas bottles for employing various reaction gasses and a plurality of recipients can be employed for an implantation of different dopants in alternation.

Method for the implantation of dopant

In an apparatus for curing semiconductor wafers implementing same is provided. Pursuant to the method, semiconductor wafers, for example, GaAs, are cured in a reaction tube under a protective gas atmosphere of, for example, a mixture of N.sub.2 and AsH.sub.3. The reaction tube is initially heated to a base temperature at which the curing process is not initiated and at which no wall coatings occur. Given semiconductor wafers of compound semiconductors such as, for axample, GaAs, the protective atmosphere contains a compound of the more volatile element, for example, AsH.sub.3, that decomposes at the base temperature and forms an over-pressure of the more volatile element. The semiconductor wafer is heated to the curing temperature with a selective heater, for example a lamp, and is exposed to the curing temperature for 5 through 20 seconds.

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Munich, Germany

Spyridon Gisdakis