Samsung Electronics Co., Ltd.

SoonMok Ha

Joonsoo Park

Dae-Yong Kang

Jaehee Kim

Sung-wook Hwang

Byungjun Jeon

Eunsung Kim

Jonghyuk Kim

Heejung Kim

Seok-Won Cho

Seongho Moon

Eunshoo Han

A method of fabricating a semiconductor device includes forming first cell patterns on a substrate, forming a first layer relative to the first cell patterns, and forming a second cell pattern and a peripheral pattern on the first layer. The second cell pattern includes first holes in a cell region and the peripheral pattern is located in a peripheral region. The method also includes filling the first holes, removing the second cell pattern to expose pillars, and forming second holes. Each of the second holes corresponds to adjacent cell spacers of the pillars. The method also includes removing the pillars to form third holes corresponding to respective ones of the cell spacers, and etching the substrate using the cell spacers, the first cell patterns, and the peripheral pattern as etch masks to form a trench.

Method of fabricating semiconductor device

A method for manufacturing a semiconductor device includes forming first and second lower structures including selection elements on first and second chip regions of a substrate, respectively, forming first and second mold layers on the first and second lower structures, respectively, forming first and second support layers on the first and second mold layers, respectively, patterning the first support layer and the first mold layer to form first holes exposing the first lower structure, forming first lower electrodes in the first holes, forming a support pattern including at least one opening by selectively patterning the first support layer while leaving the second support layer, and removing the first mold layer through the opening. A top surface of the support pattern is disposed at a substantially same level as a top surface of the second support layer.

Semiconductor devices and methods for manufacturing the same

Methods of fabricating a semiconductor device are provided. The methods may include forming a stopper layer on a target layer including a cell area and an edge area, forming a hard mask including first upper openings and dam trench on the stopper layer, forming opening spacers on inner walls of the first upper openings and a dam pattern in the dam trench, removing the stopper layer exposed in the first upper openings to form first lower openings, forming pillar patterns in the first lower openings and the first upper openings and an eaves pattern on the dam pattern, removing the hard mask in the cell area, forming a first polymer block between the pillar patterns including second upper openings, etching the stopper layer exposed in the second upper openings to form second lower openings, and removing the first polymer block, the pillar patterns, the dam pattern and the eaves pattern.

Methods of forming semiconductor devices including contact holes

A method for forming fine patterns includes patterning a hard mask layer on an etch target layer to form sacrificial pillars and a first opening disposed between the sacrificial pillars and exposing the etch target layer, forming a block copolymer layer on the etch target layer exposed through the first opening, phase-separating the block copolymer layer to form first block patterns spaced apart from the sacrificial pillars and a second block pattern, forming first holes by etching the etch target layer exposed by removing the first block patterns, and forming second holes in the etch target layer exposed by removing the sacrificial pillars, the second holes being different from the first holes.

Method for forming fine patterns of semiconductor device

The inventive concept provides methods for forming fine patterns of a semiconductor device. The method includes forming a buffer mask layer having first holes on a hard mask layer including a first region and a second region around the first region, forming first pillars filling the first holes and disposed on the buffer mask layer in the first region and second pillars disposed on the buffer mask layer in the second region, forming a block copolymer layer covering the first and second pillars on the buffer mask layer, phase-separating the block copolymer layer to form first block patterns spaced apart from the first and second pillars and a second block pattern surrounding the first and second pillars and the first block patterns, removing the first block patterns, and forming second holes in the buffer mask layer under the first block patterns.

Methods for forming fine patterns of semiconductor device

Methods of forming fine patterns for semiconductor devices are provided. A method may include sequentially forming a lower layer and a mask layer having first openings on a substrate, forming pillars to fill the first openings and protrude upward from a top surface of the mask layer, forming a block copolymer layer on the substrate with the pillars, performing a thermal treatment to the block copolymer layer to form a first block portion and second block portions, removing the second block portions to form guide openings exposing the mask layer, and etching the mask layer exposed by the guide openings to form second openings.

Growing community of inventors

Hwaseong-si, South Korea

SoonMok Ha