Sk Innovation Co., Ltd.

Sk Global Chemical Co., Ltd.

Sk Geo Centric Co., Ltd.

Soo Young Hwang

Jin Su Ham

Yu Na Shim

Min Ho Jung

Kyun Phyo Lee

Tae Wook Kwon

Jong Ho Lim

Sang Ha Son

Doh Yeon Park

Hai Jin Shin

Ki Nam Chung

Sung Gi Lee

Ju Eun Jung

Byoung Kyu Kwak

An ethylene-(meth)acrylic acid copolymer has a portion having a melting temperature of 94&#xb0; C. or higher. A content of the portion having the melting temperature of 94&#xb0; C. or higher measured by a Successive Self-nucleation and Annealing (SSA) analysis is 1.5% or less. A water-dispersive composition includes the ethylene (meth)acrylic acid copolymer, a neutralizing agent and an aqueous medium.

Ethylene-(meth)acrylic acid copolymer and water-dispersive composition including the same

Provided are a polymer used for a manufacturing process of a semiconductor and a display, a resist underlayer film composition containing the polymer for a manufacturing process of a semiconductor and a display, and a method for manufacturing semiconductor device using the composition, and more specifically, the polymer of the present disclosure simultaneously has optimized etching selectivity and planarization characteristics, such that the resist underlayer film composition containing the polymer is usable as a hard mask for a multilayer semiconductor lithography process.

Polymer for preparing resist underlayer film, resist underlayer film composition containing the polymer and method for manufacturing semiconductor device using the composition

Provided are a polymer used for a manufacturing process of a semiconductor and a display, a resist underlayer film composition containing the polymer for a manufacturing process of a semiconductor and a display, and a method for manufacturing semiconductor device using the composition, and more specifically, the polymer of the present disclosure simultaneously has optimized etching selectivity, planarization characteristic, and excellent thermal resistance, such that the resist underlayer film composition containing the polymer is usable as a hard mask for a multilayer semiconductor lithography process.

Provided are a plasticizer for a resin composition including any one or more selected from a polyvinyl chloride resin, a polyurethane resin, an epoxy resin, a polycarbonate resin or a biodegradable resin, which has excellent mechanical properties such as tensile strength, elongation and hardness, and shape processability, and particularly has excellent flexibility at low temperatures, does not cause bleeding because compatibility with the resins is good, and has excellent transparency, heat resistance, cold resistance and durability, and a resin composition including the same.

Plasticizers for resin compositions and resin compositions including the same

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Daejeon, South Korea

Soo Young Hwang