Adeia Semiconductor Bonding Technologies Inc.

Vertical Circuits, Inc.

Other

Simon J S McElrea

Lawrence Douglas Andrews, Jr

Scott P McGrath

Marc E Robinson

Scott Jay Crane

Terrence Caskey

Weiping Pan

Reynaldo Co

Grant Villavicencio

Jeffrey S Leal

DeAnn Eileen Melcher

Yong Du

Zongrong Liu

De Ann Eileen Melcher

Loreto Cantillep

Mark Scott

A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.

Semiconductor die mount by conformal die coating

Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.

Support mounted electrically interconnected die assembly

A die assembly includes a die mounted to a support, in which the support has interconnect pedestals formed at bond pads, and the die has interconnect terminals projecting beyond a die edge into corresponding pedestals. Also, a support has interconnect pedestals. Also, a method for electrically interconnecting a die to a support includes providing a support having interconnect pedestals formed at bond pads on the die mount surface of the support, providing a die having interconnect terminals projecting beyond a die edge, positioning the die in relation to the support such that the terminals are aligned with the corresponding pedestals, and moving the die and the support toward one another so that the terminals contact the respective pedestals.

Vertical electrical interconnect formed on support prior to die mount

In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.

Electrically interconnected stacked die assemblies

A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a conformal coating between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on either or both a die attach area of a surface of the die, or a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.

A die (or of a stack of die) is mounted over and elevated above a support, and is electrically connected to circuitry in the support. Pillars of electrically conductive material are formed on a set of bond pads at a mount side of the support, and the elevated die (or at least one die in the elevated stack of die) is electrically connected to the support, by traces of an electrically conductive material contacting interconnect pads on the die to the pillars, and through the pillars to the support. Also, tiered offset stacked die assemblies in a zig-zag configuration, in which the interconnect edges of a first (lower) tier face in a first direction, and the interconnect edges of a second (upper) tier, stacked over the first tier, face in a second direction, different from the first direction, are electrically connected to a support. Die in the first tier are electrically interconnected die-to-die, and the tier is electrically connected to a support, by traces of an electrically conductive material contacting interconnect pads on the die and a first set of bond pads on the support. Pillars of a electrically conductive material are formed on a second set of bond pads, and die in the second tier are electrically interconnected die-to-die, and the tier is electrically connected to the support, by traces of an electrically conductive material contacting interconnect pads on the die to the pillars, and through the pillars to the substrate.

Electrical interconnect for die stacked in zig-zag configuration

An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board).

Wafer level surface passivation of stackable integrated circuit chips

A flat leadless package includes at least one die mounted onto a leadframe and electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, an assembly includes stacked leadless packages electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, a package module includes an assembly of stacked leadless packages mounted on a support and electrically connected to circuitry in the support using an electrically conductive polymer or an electrically conductive ink.

Growing community of inventors

Scotts Valley, CA, United States of America

Simon J S McElrea