Macronix International Co., Ltd.

Shun-Li Lin

Chen-Fu Chien

Wei-Hua Hsu

Ching-Yu Chang

Yu-Lin Yen

Wen-Chung Chang

Chih-Ping Chen

Tsung-Hsien Wu

I-Pien Wu

Chia-Yu Hsu

Wen Chung Chang

Yun-Chu Lin

Kuo-Hao Chang

Ching-Yi Lee

Chi-Fang Hsieh

Yun Chu Lin

Ching Yi Lee

A structure applied to a photolithographic process is provided. The structure includes at least a film layer, an optical isolation layer, an anti-reflection coating and a photoresist layer sequentially formed over a substrate. In the photolithographic process, the optical isolation layer stops light from penetrating down to the film layer. Since the optical isolation layer is set up underneath the photoresist layer, light emitted from a light source during photo-exposure is prevented from reflecting from the substrate surface after passing through the film layer. Thus, the critical dimensions of the photolithographic process are unaffected by any change in the thickness of the film layer.

Structure applied to a photolithographic process

A method for analyzing overlay errors in lithography is described. Interfield sampling and intrafield sampling are first conducted to sample multiple positions on each of the wafers, and then the overlay error value at each of the positions is measured. An overlay error model including coefficients of intrafield and interfield overlay errors of different types is used to fit the measured overlay error values with respect to the sampled positions. In the overlay error model, the intrafield overlay errors include intrafield translation, isotropic magnification, reticle rotation, asymmetric magnification and asymmetric rotation, and the interfield overlay errors include interfield translation, scale error, wafer rotation and orthogonality error.

Method for analyzing overlay errors

A photoresist with adjustable polarized light response and a photolithography process using the photoresist. The photoresist and the photolithography process are suitable for use in an exposure optical system with a high numerical aperture. The photoresist includes a photosensitive polymer that can absorb the exposure light source to generate an optical reaction. The photosensitive polymer can also be oriented along a direction of an electric field or a magnetic field. The response for the photosensitive upon a polarized light is determined by an angle between the predetermined direction and the polarized light. In addition, the photolithography process adjusts the orientation of the photosensitive polymer, so that the P-polarized light has a weaker response than that of the S-polarized light to compensate for the larger transmission coefficient of the P-polarized light with a high numerical aperture, so as to prevent the photoresist pattern deformation.

Photoresist with adjustable polarized light reaction and photolithography process using the photoresist

A structure applied to a photolithographic process is provided. The structure comprises at least a film layer, an optical isolation layer, an anti-reflection coating and a photoresist layer sequentially formed over a substrate. In the photolithographic process, the optical isolation layer stops light from penetrating down to the film layer. Since the optical isolation layer is set up underneath the photoresist layer, light emitted from a light source during photo-exposure is prevented from reflecting from the substrate surface after passing through the film layer. Thus, the critical dimensions of the photolithographic process are unaffected by any change in the thickness of the film layer.

Structure applied to a photolithographic process and method for fabricating a semiconductor device

In the manufacturing of VLSI circuits, production of overlay is a critical step. To obtain a higher resolution and alignment accuracy in microlithographic process, overlay errors must be measured so that overlay errors can be reduced to a tolerable level. This invention provides an overlay error model and a sampling strategy. Utilizing the overlay model and sampling strategy, a device for measuring overlay errors is also designed.

Overlay error model, sampling strategy and associated equipment for implementation

A mask with extended mask window for forming patterns on a semiconductor substrate. The mask includes a main chip array having four sides for forming patterns of a main chip in a semiconductor substrate and a plurality of extended mask windows arranged around the main chip array. A method of dummy exposure using the mask includes providing a semiconductor substrate comprising a nitride layer with a plurality of main chip areas therein, and a plurality of unpatterned areas therein, forming a resist layer on the semiconductor substrate, providing an exposure mask comprising a main chip array and a plurality of extended mask windows, patterning the main chip areas of the semiconductor substrate using the main chip array of the exposure mask, patterning the unpatterned areas of the semiconductor substrate using the windows of the exposure mask, and removing the unexposed portions of the resist layer.

Mask with extended mask clear-out window and method of dummy exposure using the same

A method of optical proximity correction, suitably applied to a photolithography process with a high numeric aperture. The exposure light comprises a P-polarized light and an S-polarized light perpendicular to the P-polarized light. The P-polarized light has a transmission coefficient larger than that of the S-polarized light. In this method, different optical proximity correction modes are applied to the patterns with different orientations. While correcting any pattern, the ratio of transmission coefficient of the P-polarized light to the S-polarized light and the polarization angle between the pattern orientation and the polarization direction of the P-polarization/S-polarization light are considered.

Method of optical proximity correction

The invention provides a method for reducing roughness of the photoresist through cross-linking reaction of deposit and the photoresist. The method comprises at least performing an exposure process to a substrate having a photoresist pattern and performing a post-exposure bake process for activating the surface of photoresist pattern. A material layer is formed to cover the surface of the photoresist pattern. The material layer cross-links with the hydrogen ions on the surface of the photoresist pattern, so that a filling layer is formed to fills asperity or the rough regions of the photoresist pattern.

Method for reducing roughness of photoresist through cross-linking reaction of deposit and photoresist

A photoresist layer comprising an optically active component is provided, so that after an incident linearly polarized light penetrates the photoresist layer, the intensity ratio of an S wave polarization and a P wave polarization divided from the linearly polarized light is effectively 1:1 so improving astigmatism.

Method of improving astigmatism of a photoresist layer

An optical proximity correction method for producing a rectangular contact. The method includes representing the rectangular contact pattern required by an integrated circuit by a pair of connected hammerhead patterns and serif patterns at the inner straight corners of the hammerhead patterns. By varying the width of the connecting section of the hammerhead patterns, an optimal aspect ratio for the rectangular pattern is obtained.

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Hsinchu, Taiwan

Shun-Li Lin